Publications

Found 155 results
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Nishida, T., "Wireless Implantable Recording Electrodes (FWIRE) for Brain Machine Interfaces", IEEE International Symposium on Circuits and Systems, 2007 (ISCAS 2007), pp. 2084 , May, 2007.
Nishida, T., J. Lin, K. Ngo, F. Ren, D. Norton, S. J. Pearton, L. Cattafesta, M. Sheplak, J. Jun, A. Kasyap V.S., et al., "Wireless Hydrogen Sensor Self-powered Using Ambient Vibration and Light", Proceedings of ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2006-14644, November, 2006.
Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", 9th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2003-3197, Hilton Head, SC, May, 2003.
Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", J. Acoust. Soc. Am., vol. 115, no. 2, pp. 757-767, MAR, 2004.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
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Gu, P., T. Nishida, and H. Fan, "The use of polyurethane as an elastomer in thermoplastic microfluidic devices and the study of its creep properties", ELECTROPHORESIS, vol. 35, issue 2-3, pp. 289 - 297, 02/2014, 2013.
Thompson, S., G-Y. Sun, Y. Choi, and T. Nishida, "Uniaxial Process Induced Strained Si: Extending the CMOS Roadmap", IEEE Trans. Electron Dev., vol. 53, pp. 1010-1020, MAY, 2006.
Schultz, T., L. Cattafesta, T. Nishida, and M. Sheplak, "Uncertainty Analysis of the Two-Microphone Method", 8th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2002-2465, June, 2002.
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Thompson, S., and T. Nishida, "Tunneling and thermal emission of electrons from a distribution of shallow traps in SiO2", Applied Physics Letters, vol. 58, pp. 1262-1264, DEC, 1991.
Liu, F., S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, "A Tunable Electromechanical Helmholtz Resonator", 9th AIAA/CEAS Aeroacoustics Conference and Exhibit, AIAA Paper 2003-3145, Hilton Head, SC, May, 2003.
Nishida, T., "TSensors Vision: Enabling Sustainable Solutions for the Global Environment through Novel Sensing", MEMS & Sensors Executive Congress, 2016.
Park, H. W., S. K. Dixit, Y. Choi, R. D. Schrimpf, E. Filangeri, T. Nishida, and S. Thompson, "Total Ionizing Dose Effects on Strained HfO2-based nMOSFETs", IEEE Transactions on Nuclear Science, vol. 55, pp. 2981-2985, DEC, 2008.
Streit, W. J., Q-S. Xue, A. Prasad, V. Sankar, E. Knott, A. T. Dyer, J. R. Reynolds, T. Nishida, G. Shaw, and J. C. Sanchez, "Tissue, Electrical, and Material Responses in Electrode Failure", IEEE Pulse, vol. 3, issue 1, pp. 30 - 33, 01/2012.
Walters, G., A. Shekhawat, N. G. Rudawski, S. Moghaddam, and T. Nishida, Tiered deposition of sub-5 nm ferroelectric Hf1-xZrxO2 films on metal and semiconductor substrates, 2018.
Walters, G., A. Shekhawat, N. G. Rudawski, S. Moghaddam, and T. Nishida, "Tiered deposition of sub-5 nm ferroelectric Hf 1-x Zr x O 2 films on metal and semiconductor substrates", Applied Physics Letters, vol. 112, issue 19, pp. 192901, Jul-05-2018.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
Lu, S., T. Nishida, and C-T. Sah, "Thermal emission and capture rates of holes at the gold donor level in silicon", Journal of Applied Physics, vol. 62, no. 12, pp. 4773-4780, DEC, 1987.
Yang, X., S. Parthasarathy, Y. Sun, A. D. Koehler, T. Nishida, and S. Thompson, "Temperature dependence of enhanced hole mobility in uniaxial strained p-channel metal-oxide-semiconductor field-effect transistors and insight into the physical mechanisms", Appl. Phys. Lett., vol. 93, pp. 243503-1–243503-3, DEC, 2008.
Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.
Taylor, R., F. Liu, S. Horowitz, K. Ngo, T. Nishida, L. Cattafesta, and M. Sheplak, "Technology Development for Electromechanical Acoustic Liners", Active 04 Paper a04-093, Williamsburg, VA, September, 2004.
Sanchez, J. C., J. Principe, T. Nishida, R. Bashirullah, J. Harris, and J. Fortes, "Technology and Signal Processing for Brain-Machine Interfaces", IEEE Signal Processing Magazine, vol. 25, pp. 29-40, SEP, 2008.
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Phipps, A., and T. Nishida, "System Modeling of Piezoelectric Energy Harvesters", IEEE Trans. Power Electronics, vol. 27, issue 2, 2012.
Martin, D., K. Kadirvel, T. Nishida, and M. Sheplak, "A Surface Micromachined Capacitive Microphone for Aeroacoustic Applications", Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2008.
Martin, D., K. Kadirvel, J. Liu, R. M. Fox, M. Sheplak, and T. Nishida, "Surface and Bulk Micromachined Dual Back-Plate Condenser Microphone", 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2005), Miami, FL, January, 2005.