| Title | A Wafer-Bonded, Floating Element Shear-Stress Sensor |
| Publication Type | Conference Paper |
| Year of Publication | 2004 |
| Authors | Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak |
| Conference Name | Solid State Sensor, Actuator and Microsystems Workshop |
| Date Published | June |
| Conference Location | Hilton Head, SC |
