Through Wafer Electrical Interconnects for MEMS Sensors

TitleThrough Wafer Electrical Interconnects for MEMS Sensors
Publication TypeConference Paper
Year of Publication2001
AuthorsChandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak
Conference NameProceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846
Date PublishedNovember
Conference LocationNew York, NY