| Title | Through Wafer Electrical Interconnects for MEMS Sensors |
| Publication Type | Conference Paper |
| Year of Publication | 2001 |
| Authors | Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak |
| Conference Name | Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846 |
| Date Published | November |
| Conference Location | New York, NY |
