Publications

Found 299 results
Author [ Title(Desc)] Type Year
Filters: Author is Xie, H.  [Clear All Filters]
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 
1
Wu, L., and H. Xie, "A 124° rotation angle electrothermal micromirror with integrated platinum heater", IEEE Journal of Selected Topics in Quantum Electronics, vol. 13, issue 2, pp. 316 - 321, 3/2007.
Fang, D., H. Qu, and H. Xie, "A 1mW Dual-Chopper Amplifier for a 50-μg√Hz Monolithic CMOS-MEMS Capacitive Accelerometer", 2006 Symposium on VLSI Circuits, 2006. Digest of Technical Papers.2006 Symposium on VLSI Circuits, 2006. Digest of Technical Papers., Honolulu, HI, USA, IEEE, pp. 59 - 60, 2006.
2
Wu, L., S. Samuelson, J. Sun, K. Jia, W. Lau, S. Choe, B. S. Sorg, and H. Xie, "A 2.8-mm imaging probe based on a high-fill-factor mems mirror and wire-bonding-free packaging for endoscopic optical coherence tomography", IEEE MEMS 2011, Cancun, Mexico, 2011.
Tanguy, Q., C. Duan, W. Wang, H. Xie, S. Bargiel, P. Struk, P. Lutz, and C. Gorecki, "A 2-axis electrothermal MEMS micro-scanner with torsional beam", 2016 International Conference on Optical MEMS and Nanophotonics (OMN), Singapore, Singapore, IEEE, 2016.
Jain, A., T. Xie, Y. Pan, G. K. Fedder, and H. Xie, "A 2-Axis Electrothermal SCS Micromirror for Biomedical Imaging", Proceedings of the 2003 IEEE/LEOS International Conference on Optical MEMS, Waikoloa, HI, USA, 2003.
Tanguy, Q. A. A., S. Bargiel, C. Duan, W. Wang, P. Struk, H. Xie, P. Lutz, and C. Gorecki, "A 2-axis MEMS scanning micromirror with a 45° auto-positioning mechanism for endoscopic probe", 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Kaohsiung, Taiwan, IEEE, 2017.
Lee, K-S., C. Koehler, E. G. Johnson, E. Valaski Teuma, O. Ilegbusi, M. Costa, H. Xie, and J. P. Rolland, "2mm catheter design for endoscopic optical coherence tomography", International Optical Design Conference 2006Proceedings of SPIE, vol. 6342, Vancouver, BC, Canada, SPIE, pp. 63420F - 63420F-9, 2006.
3
Lee, K., L. Wu, H. Xie, and J. P. Rolland, "A 3 mm catheter for constant depth-resolution probing in Fourier domain optical coherence endoscopy", Proceedings of the SPIE Photonics West 2007, San Jose, CA, USA, 2007.
Liu, L., and H. Xie, "3-D Confocal Laser Scanning Microscopy Based on a Full-MEMS Scanning System", IEEE Photonics Technology Letters, vol. 25, issue 15, pp. 1478 - 1480, 08/2013.
Xie, H., "3-D Endoscopic Optical Coherence Tomography Based on Rapid-Scanning MEMS Mirrors", 2009 Asia Communications and Photonics Conference and Exhibition, Shanghai, China, 2009.
Sun, J., S. Guo, L. Wu, L. Liu, S. Choe, B. S. Sorg, and H. Xie, "3D In Vivo optical coherence tomography based on a low-voltage, large-scan-range 2D MEMS mirror", Optics Express, vol. 18, 2010.
Todd, S., A. Jain, H. Qu, and H. Xie, "A 3-D Micromirror Utilizing Inverting-Series-Connected Electrothermal Bimorph Actuators for Piston and Tilt Motion", 2005 IEEE/LEOS International Conference on Optical MEMS and Their Applications, Oulu, Finland, IEEE, August, 2005.
Guo, S., A. Pozzi, C. Ling, J. Sun, L. Wu, L. Liu, and H. Xie, "3D Polarization-Sensitive Optical Coherence Tomography of Canine Meniscus Based on a 2D High-Fill-Factor Microelectromechanical Mirror", 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society , Minneapolis, MN, 2009.
4
Duan, C., W. Wang, X. Zhang, J. Ding, Q. Chen, A. Pozzi, and H. Xie, "A 45°-tilted 2-axis scanning micromirror integrated on a silicon optical bench for 3D endoscopic optical imaging", 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Estoril, Portugal, IEEE, pp. 948 - 951, 1/2015.
A
Guo, Z. Yang, Q. Cheng Zhao, L. Tao Lin, H. T. Ding, X. S. Liu, J. Cui, Z. Chuan Yang, H. Xie, and G. Zhen Yan, "An acceleration switch with a robust latching mechanism and cylindrical contacts", Journal of Micromechanics and Microengineering, vol. 20, issue 5, pp. 055006, 05/2010.
Tasneem, Z., C. Adhivarahan, D. Wang, H. Xie, and K. Dantu, Adaptive fovea for scanning depth sensors, 2020.
Jia, K., S. Pal, and H. Xie, "An Agile Tip-Tilt-Piston Micromirror With Large Aperture, Large Scanning Range and Low Driving Voltage", Hilton Head 2008, Technical Digest pp. 284-287, 2008.
Pal, S., and H. Xie, "Analysis and Fabrication of Curved Multimorph Transducers that Undergo Bending and Twisting", IEEE/ASME Journal of Microelectromechanical Systems (accepted, In Press), 2012.
Pal, S., and H. Xie, "Analysis and Simulation of Curved Bimorph Microactuators", Microtech Conference and Expo (Nanotech 2010 vol. 2), Anaheim, CA, NSTI, 2010.
Pal, S., and H. Xie, "Analysis, simulation and fabrication of curved multimorphs that undergo bending and twisting", Sensors, 2011 IEEE, pp. 667-670, Oct, 2011.
Todd, S., and H. Xie, "An analytical electrothermal model of a 1D electrothermal MEMS micromirror", Smart Structures, Devices, and Systems IIProceedings of SPIE, vol. 5649, Sydney, Australia, SPIE, pp. 344 - 353, 2005.
Todd, S., and H. Xie, "An Analytical Electrothermal Model of a 1-D Electrothermal MEMS Micromirror", SPIE International Symposium on Smart Materials, Nano-, and Micro-Smart Systems, Sydney, Australia, December, 2004.
Cheng, J., W. Liu, Q. Chen, N. Xu, Q. Sun, Y. Liu, W. Wang, and H. Xie, "An auto-aligned vertical comb drive for low-cost variable optical attenuators", 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Kaohsiung, IEEE, 2017.
B
Wang, W., Q. Chen, D. Wang, L. Zhou, and H. Xie, "A bi-directional large-stroke electrothermal MEMS mirror with minimal thermal and temporal drift", 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS)2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS), Las Vegas, NV, USA, IEEE, 2017.