|Title||An analytical electrothermal model of a 1D electrothermal MEMS micromirror|
|Publication Type||Conference Paper|
|Year of Publication||2005|
|Authors||Todd, S., and H. Xie|
|Conference Name||Smart Structures, Devices, and Systems IIProceedings of SPIE|
|Conference Location||Sydney, Australia|
|Keywords||electrothermal actuation, Heat Transport, lumped element modeling, MEMS, micromirror|
We have developed an analytical model that describes the steady-state thermal behavior of a 1-D electrothermal bimorph MEMS micromirror. The steady-state 1-D heat transport equation is used to solve for the temperature distribution of the device upon actuation. Three models are developed using different thermal conditions on the device. The modelsconsider heat dissipation from conduction and convection and the temperaturedependence of the actuator electrical resistor. The temperature distribution equation of each model is analyzed to find critical thermal parameters such as the position of maximum temperature, maximum temperature, average temperature, and equivalent thermal resistance. The simplest model, called the Case 1 model, is used to develop an electrothermal lumped element model that uses a single thermal power source. In the Case 1 model, it is shown that a parameter called the "balancing factor" predicts where the maximum temperature is located, the distribution of power flow, and the division ofthermal resistances. The analytical models are compared to FEM simulations and agree within 20% for all of the actuation ranges and thermal conditions tested.