Publications

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Z. Fan, H., S. Mangru, R. Granzow, P. Heaney, W. Ho, Q. Dong, and R. Kumar, "Dynamic DNA Hybridization on a Chip Using Paramagnetic Beads", Analytical Chemistry, vol. 71, issue 21, pp. 4851 - 4859, 11/1999.
Kim, J., Y-K. Yoon, and M. G. Allen, "Double-side exposure UV-LED CNC lithography for fine 3D microfabrication", 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Los Angeles, CA, USA, IEEE, 2017.
Kim, J., PF. Jao, C. Kim, and Y.K. Yoon, "Dispense and self planarization process on a modified surface for multiple height 3-D microfabrication", The 16th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’11), Beijing, China, 06/2011.
Kim, J., PF. Jao, C. Kim, and Y.K. Yoon, "Dispense and self planarization process on a modified surface for multiple height 3-D microfabrication", The 16th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’11), Beijing, China, 06/2011.
Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi, "Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Neugroschel, A., C-T. Sah, K. Han, M. Carroll, T. Nishida, J. Kavalieros, and Y. Lu, "Direct-current measurements of oxide and interface traps on oxidized silicon", IEEE Trans. Electron Dev., vol. 42, pp. 1657-1662, SEP, 1995.
Petrov, G., J. Davis, W. Schumaker, M. Vargas, V. Chvykov, B. Hou, A. Maksimchuk, V. Yanovsky, A. G. R. Thomas, K. Krushelnick, et al., "Development of mini-undulators for a table-top free-electron laserAbstract", Laser and Particle Beams, vol. 36, issue 3, pp. 396 - 404, Jan-09-2018.
Kasyap, A., A. Phipps, T. Nishida, M. Sheplak, and L. Cattafesta, "Development of MEMS-based Piezoelectric Vibration Energy Harvesters", SEC IMAC, 02/2010.
Freidkes, B., D. A. Mills, C. Keane, L. S. Ukeiley, and M. Sheplak, "Development of a Two-Dimensional Wall Shear Stress Sensor for Wind Tunnel Applications", AIAA Scitech 2019 ForumAIAA Scitech 2019 Forum, San Diego, CaliforniaReston, Virginia, American Institute of Aeronautics and Astronautics, 2019.
Martin, D., J. Liu, K. Kadirvel, R. M. Fox, M. Sheplak, and T. Nishida, "Development of a MEMS Dual Backplate Capacitive Microphone for Aeroacoustic Measurements", 44th AIAA Aerospace Sciences Meeting and Exhibit, AIAA Paper 2006-1246, Reno, NV, January, 2006.
Dudek, M. M., N. J. Kent, P. Gu, H. Z. Fan, and A. J. Killard, "Development of a fluorescent method for detecting the onset of coagulation in human plasma on microstructured lateral flow platforms", The Analyst, vol. 136, issue 9, pp. 1816, 2011.
Dudek, M. M., N. J. Kent, P. Gu, H. Z. Fan, and A. J. Killard, "Development of a fluorescent method for detecting the onset of coagulation in human plasma on microstructured lateral flow platforms", The Analyst, vol. 136, issue 9, pp. 1816, 2011.
Khnouf, R., B. Chapman, S. Jin, D. J. Beebe, and H. Z. Fan, "Detection of ricin in beverages using cell-free protein synthesis in a microfluidic device", Sensors and Actuators B: Chemical, vol. 221, pp. 723 - 729, 12/2015.
Kadirvel, K., D. Martin, J. Liu, R. M. Fox, M. Sheplak, L. Cattafesta, and T. Nishida, "Design, Modeling and Simulation of a Closed-Loop Controller for a Dual Backplate MEMS Capacitive Microphone", 6th IEEE Conference on Sensors, Atlanta, GA, pp. 87-90, October, 2007.
Kadirvel, K., R. Taylor, S. Horowitz, W. Hunt, M. Sheplak, and T. Nishida, "Design and Characterization of a MEMS Optical Microphone", 42nd Aerospace Sciences Meeting and Exhibit, AIAA Paper 2004-1030, Reno, NV, January, 2004.
Kim, H-in., D. P. Arnold, and Y-K. Yoon, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), 2022.
Kim, H-in., R. Bowrothu, W. Lee, C. Smith, L. Hayati, D. P. Arnold, and Y-K. Yoon, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Tokyo, Japan, IEEE, 2022.