Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging

TitleDemonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging
Publication TypeConference Paper
Year of Publication2022
AuthorsKim, H-in., R. Bowrothu, W. Lee, C. Smith, L. Hayati, D. P. Arnold, and Y-K. Yoon
Conference Name2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)
PublisherIEEE
Conference LocationTokyo, Japan
URLhttps://ieeexplore.ieee.org/document/9699731/http://xplorestaging.ieee.org/ielx7/9698823/9699435/09699731.pdf?arnumber=9699731
DOI10.1109/MEMS51670.2022.9699731