| Title | Cu/Co Metaconductor Based Highly Energy-Efficient Bonding Wires for next Generation Millimeter wave Electronic Interconnects |
| Publication Type | Conference Proceedings |
| Year of Conference | 2022 |
| Authors | Jeon, S., H-in. Kim, W. Lee, and Y-K. Yoon |
| Conference Name | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
