| Title | Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging |
| Publication Type | Conference Paper |
| Year of Publication | 2017 |
| Authors | Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi |
| Conference Name | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| Publisher | IEEE |
| Conference Location | Orlando, FL, USA |
| URL | http://ieeexplore.ieee.org/document/7999702/ |
| DOI | 10.1109/ECTC.2017.258 |
