Publications

Sui, W., H. Wang, J. Lee, Afzaal Qamar, Mina Rais-Zadeh, and P. X. - L. Feng, "AlScN-on-SiC Thin Film Micromachined Resonant Transducers Operating in High-Temperature Environment up to 600 °C", ADVANCED FUNCTIONAL MATERIALS, June 21 2022.

Jeon, S., H-in. Kim, W. Lee, and Y-K. Yoon, "Cu/Co Metaconductor Based Highly Energy-Efficient Bonding Wires for next Generation Millimeter wave Electronic Interconnects", 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022.

Kim, H-in., R. Bowrothu, W. Lee, C. Smith, L. Hayati, D. P. Arnold, and Y-K. Yoon, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Tokyo, Japan, IEEE, 2022.

Kim, H-in., D. P. Arnold, and Y-K. Yoon, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), 2022.

Sui, W., X-Q. Zheng, J-T. Lin, J. Lee, J. L. Davidson, R. A. Reed, R. D. Schrimpf, B. W. Alphenaar, M. L. Alles, and P. X. - L. Feng, "Effects of Ion-Induced Displacement Damage on GaN/AlN MEMS Resonators", IEEE TRANSACTIONS ON NUCLEAR SCIENCE, vol. 69, issue 3, January 14, 2022.

Sui, W., X-Q. Zheng, J-T. Lin, J. Lee, J. L. Davidson, R. A. Reed, R. D. Schrimpf, B. W. Alphenaar, M. L. Alles, and P. X. - L. Feng, "Effects of Ion-Induced Displacement Damage on GaN/AlN MEMS Resonators", IEEE TRANSACTIONS ON NUCLEAR SCIENCE, vol. 69, issue 3, January 14, 2022.

Mo, D., S. Rassay, C. Li, and R. Tabrizian, "Intrinsically switchable dual‐band scandium‐aluminum nitride Lamb‐wave filter", physica status solidi (RRL) – Rapid Research Letters, Oct-08-2022.

Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon, "3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.

Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon, "3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.

Kulkarni, V., V. Yashasvi Lolla, S. Rao Tamvada, N. Shirdade, and S. Anand, "Coalescence and spreading of drops on liquid pools", Journal of Colloid and Interface Science, vol. 586, pp. 257 - 268, Jan-03-2021.

Lee, W., and Y-K. Yoon, "High Efficiency Metamaterial-based Multi-scale Wireless Power Transfer for Smart Home Applications", International Microwave Symposium 2021, 2021.

Cho, H., W. Lee, and Y-K. Yoon, "Highly Compact Array MIMO Module for EMI Immune 5G Wireless Communications", International Microwave Symposium 2021, 2021.

Heidari, H., M. Ozturk, R. Ghannam, M-K. Law, H. Khanbareh, and M. A. Halim, "IEEE Access Special Section Editorial: Energy Harvesting Technologies for Wearable and Implantable Devices", IEEE Access, vol. 9, pp. 91324 - 91327, Jan-01-2021.

Alipanahrostami, M., X. Jiang, C. Manzanas, J. C. Loeb, M. Pan, T. B. Tilly, J. A. Lednicky, C-Y. Wu, and H. Z. Fan, "Integration of Sample Preparation with RNA Amplification Device for Influenza Virus Detection", International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS), pp. 37-38, 2021.

Alipanahrostami, M., X. Jiang, C. Manzanas, J. C. Loeb, M. Pan, T. B. Tilly, J. A. Lednicky, C-Y. Wu, and H. Z. Fan, "Integration of Sample Preparation with RNA Amplification Device for Influenza Virus Detection", International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS), pp. 37-38, 2021.

Rassay, S., D. Mo, C. Li, N. Choudhary, C. Forgey, and R. Tabrizian, "Intrinsically Switchable Ferroelectric Scandium Aluminum Nitride Lamb-Mode Resonators", IEEE Electron Device Letters, vol. 42, issue 7, pp. 1065 - 1068, Jan-07-2021.

Lee, W., S-il. Choi, H-in. Kim, S. Hwang, S. Jeon, and Y-K. Yoon, Metamaterial-Integrated High-Gain Rectenna for RF Sensing and Energy Harvesting Applications, 2021.

Lanier, O. L., C. Velez, D. P. Arnold, and J. Dobson, "Model of Magnetic Particle Capture Under Physiological Flow Rates for Cytokine Removal During Cardiopulmonary Bypass", IEEE Transactions on Biomedical Engineering, vol. 68, issue 4, pp. 1198 - 1207, Jan-04-2021.

Z. Fan, H., C. Manzanas, M. Alipanahrostami, J. A. Lednicky, and C-Y. Wu, Multiplex Devices and Methods for Pathogen Detection, 2021.

Liu, Y., H. Khanbareh, M. A. Halim, A. Feeney, X. Zhang, H. Heidari, and R. Ghannam, "Piezoelectric energy harvesting for self‐powered wearable upper limb applications", Nano Select, Sep-02-2021.

Lee, W., and Y-K. Yoon, "Rollable metamaterial screen for magnetic resonance coupling-based high-efficiency wireless power transferAbstract", International Journal of Microwave and Wireless Technologies, vol. 13, issue 4, pp. 365 - 373, Jan-05-2021.

Rassay, S., F. Hakim, C. Li, C. Forgey, N. Choudhary, and R. Tabrizian, "A Segmented‐Target Sputtering Process for Growth of Sub‐50 nm Ferroelectric Scandium–Aluminum–Nitride Films with Composition and Stress Tuning", physica status solidi (RRL) – Rapid Research Letters, vol. 15, issue 5, pp. 2100087, Jan-05-2021.

Sui, W., X-Q. Zheng, J-T. Lin, B. W. Alphenaar, and P. X. - L. Feng, "TEMPERATURE DEPENDENCE OF MULTIMODE GALLIUM NITRIDE/ALUMINUM NITRIDE (GaN/AlN) HETEROSTRUCTURE STRING RESONATOR", IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS), March 2021.

Sui, W., X-Q. Zheng, J-T. Lin, B. W. Alphenaar, and P. X. - L. Feng, "Thermal Response and TC f of GaN/AlN Heterostructure Multimode Micro String Resonators From −10 C Up to 325 C", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, vol. 30, issue 4, June 25, 2021.

Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.