| Title | Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications |
| Publication Type | Conference Paper |
| Year of Publication | 2021 |
| Authors | Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon |
| Conference Name | 2021 IEEE 71st Electronic Components and Technology Conference |
| URL | chrome-extension://oemmndcbldboiebfnladdacbdfmadadm/https://www.ectc.net/program/71-ECTCPrgBrochure-Web.pdf |
