| Title | 3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications |
| Publication Type | Conference Paper |
| Year of Publication | 2021 |
| Authors | Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon |
| Conference Name | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| Publisher | IEEE |
| Conference Location | San Diego, CA, USA |
| URL | https://ieeexplore.ieee.org/document/9501802/http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501802.pdf?arnumber=9501802 |
| DOI | 10.1109/ECTC32696.2021.00213 |
