| Title | 3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications |
| Publication Type | Conference Paper |
| Year of Publication | 2021 |
| Authors | Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon |
| Conference Name | 2021 IEEE 71st Electronic Components and Technology Conference |
