Publications

Found 197 results
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Senior, D., X. Cheng, PF. Jao, C. Kim, J. Kim, and Y.K. Yoon, "Wireless passive sensing application using a cavity loaded evanescent wave half mode substrate integrated waveguide resonator", The 16th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’11), Beijing, China, June 2011.
Senior, D., X. Cheng, PF. Jao, C. Kim, J. Kim, and Y.K. Yoon, "Wireless passive sensing application using a cavity loaded evanescent wave half mode substrate integrated waveguide resonator", The 16th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’11), Beijing, China, June 2011.
Zhang, X., S. J. Koppal, R. Zhang, L. Zhou, E. Butler, and H. Xie, "Wide-angle structured light with a scanning MEMS mirror in liquid", Optics Express, vol. 24, issue 4, no. 4, pp. 3479-3487, 02/2016.
Zhang, X., L. Zhou, C. Duan, D. Zheng, S. Koppal, Q. Tanguy, and H. Xie, "A wide-angle immersed MEMS mirror and its application in optical coherence tomography", 2016 International Conference on Optical MEMS and Nanophotonics (OMN), Singapore, Singapore, IEEE, 2016.
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Lee, S. Jin, J. Sun, M. King, H. Xie, and M. Sarntinoranont, "Viscoelastic Property Changes of Acute Rat Brain Tissue Slices As A Function Of Cell Viability", ASME 2011 Summer Bioengineering Conference (SBC2011), Famington, Pennsylvania, USA, June 22-25, 2011.
Albertani, R., P. Khambatta, A. Hart, L. Ukeiley, M. Oyarzun, L. Cattafesta, and G. Abate, "Validation of a Low Reynolds Number Aerodynamic Characterization Facility", 47th AIAA Aerospace Sciences Meeting, AIAA Paper 2009-0880, January, 2009.
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Gu, P., T. Nishida, and H. Fan, "The use of polyurethane as an elastomer in thermoplastic microfluidic devices and the study of its creep properties", ELECTROPHORESIS, vol. 35, issue 2-3, pp. 289 - 297, 02/2014, 2013.
Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.
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Jain, A., A. Kopa, Y. Pan, G. K. Fedder, and H. Xie, "A Two-Axis Electrothermal Micromirror for Endoscopic Optical Coherence Tomography", IEEE Journal of Selected Topics in Quantum Electronics, vol. 10, issue 3, pp. 636 - 642, 05/2004.
Kim, H-in., R. Bowrothu, and Y-K. Yoon, "Tri-axis Polarized Loop Antenna for mmWave Wireless Inter/intra Chip Communications", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2020.
Streit, W. J., Q-S. Xue, A. Prasad, V. Sankar, E. Knott, A. T. Dyer, J. R. Reynolds, T. Nishida, G. Shaw, and J. C. Sanchez, "Tissue, Electrical, and Material Responses in Electrode Failure", IEEE Pulse, vol. 3, issue 1, pp. 30 - 33, 01/2012.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
Cassano, C.L., K. Mawatari, T. Kitamori, and Z.H. Fan, "Thermal Lens Microscopy as a Detector in Microdevices", Electrophoresis, vol. 35, no. 12, 02/2014.
Unni, M., A. M. Uhl, S. Savliwala, B. H. Savitzky, R. Dhavalikar, N. Garraud, D. P. Arnold, L. F. Kourkoutis, J. S. Andrew, and C. Rinaldi, "Thermal Decomposition Synthesis of Iron Oxide Nanoparticles with Diminished Magnetic Dead Layer by Controlled Addition of Oxygen", ACS Nano, vol. 11, issue 2, pp. 2284 - 2303, Apr-02-2019, 2017.
Unni, M., A. M. Uhl, S. Savliwala, B. H. Savitzky, R. Dhavalikar, N. Garraud, D. P. Arnold, L. F. Kourkoutis, J. S. Andrew, and C. Rinaldi, "Thermal Decomposition Synthesis of Iron Oxide Nanoparticles with Diminished Magnetic Dead Layer by Controlled Addition of Oxygen", ACS Nano, vol. 11, issue 2, pp. 2284 - 2303, 02/2017.
Mazzoleni, M. J., B. P. Bernard, N. Garraud, D. P. Arnold, and B. P. Mann, "Theoretical and Experimental Analysis of Bifurcation Induced Passive Bandgap Reconfiguration", Conference Proceedings of the Society for Experimental Mechanics SeriesNonlinear Dynamics, vol. 1, Cham, Springer International Publishing, pp. 155 - 162, 2016.
Yang, X., S. Parthasarathy, Y. Sun, A. D. Koehler, T. Nishida, and S. Thompson, "Temperature dependence of enhanced hole mobility in uniaxial strained p-channel metal-oxide-semiconductor field-effect transistors and insight into the physical mechanisms", Appl. Phys. Lett., vol. 93, pp. 243503-1–243503-3, DEC, 2008.
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Martin, D., K. Kadirvel, T. Nishida, and M. Sheplak, "A Surface Micromachined Capacitive Microphone for Aeroacoustic Applications", Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, June, 2008.
Martin, D., K. Kadirvel, J. Liu, R. M. Fox, M. Sheplak, and T. Nishida, "Surface and Bulk Micromachined Dual Back-Plate Condenser Microphone", 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2005), Miami, FL, January, 2005.
Shukla, S., X. Vidal, E. P. Furlani, M. T. Swihart, K. T. Kim, Y.K. Yoon, A. Urbas, and P. N. Prasad, "Subwavelength direct laser patterning of conductive gold nanostructures by simultaneous photopolymerization and photoreduction", ACS Nano, vol. 5 (3), 2011.
Fang, S-P., PF. Jao, D. E. Senior, K-T. Kim, and Y-K. Yoon, "Study on high throughput nanomanufacturing of photopatternable nanofibers using tube nozzle electrospinning with multi-tubes and multi-nozzles", Micro and Nano Systems Letters, vol. 5, issue 1, Jan-27-2017.
Ok, I., K. Akarvardar, S. Lin, M. Baykan, C.D. Young, P.Y. Hung, M.P. Rodgers, S. Bennett, H.O. Stamper, D.L. Franca, et al., "Strained SiGe and Si FinFETs for High Performance Logic with SiGe/Si Stack on SOI", International Electron Devices Meeting, San Francisco, CA, IEEE, 2010.
Son, S. Y., Y. Choi, P. Kumar, H. W. Park, T. Nishida, R. K. Singh, and S. Thompson, "Strain induced changes in gate leakage current and dielectric constant of nitrided Hf-silicate metal oxide semiconductor capacitors", Appl. Phys. Lett., vol. 93, pp. 153505-1–153505-3, OCT, 2008.