Title | Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications |
Publication Type | Conference Paper |
Year of Publication | 2021 |
Authors | Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon |
Conference Name | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
Publisher | IEEE |
Conference Location | San Diego, CA, USA |
URL | https://ieeexplore.ieee.org/document/9501681/http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501681.pdf?arnumber=9501681 |
DOI | 10.1109/ECTC32696.2021.00194 |