Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications

TitleUltra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications
Publication TypeConference Paper
Year of Publication2021
AuthorsKim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon
Conference Name2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
PublisherIEEE
Conference LocationSan Diego, CA, USA
URLhttps://ieeexplore.ieee.org/document/9501681/http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501681.pdf?arnumber=9501681
DOI10.1109/ECTC32696.2021.00194