Publications

Chu, M., A. D. Koehler, A. Gupta, T. Nishida, and S. Thompson, "Simulation of AlGaN/GaN high-electron-mobility transistor gauge factor based on two-dimnensional electron gas density and electron mobility", J. Appl. Phys. , vol. 108, pp. 6, 11/2010.

Senior, D., X. Cheng, M. Machado, and Y.K. Yoon, "Single and Dual Band Bandpass Filters Using Complementary Split Ring Resonator Loaded Half Mode Substrate Integrated Waveguide", 2010 IEEE Antenna Propagation Symposium, Toronto, Canada, July 2010.

Benard, N., E. Moreau, J. Griffin, and L. Cattafesta, "Slope seeking for autonomous lift improvement by plasma surface discharge", Experiments in Fluids, vol. 48, issue 5, pp. 791-808, 05/2010.

Yardibi, T., J. Li, P. Stoica, and L. Cattafesta, "Sparsity Constrained Deconvolution Approaches for Acoustic Source Mapping", J. Acous. Soc. Amer., vol. 123, no. 5, pp. 2631-2642, MAY, 2008.

Kagan, C. R., D. P. Arnold, D. J. Cappelleri, C. M. Keske, and K. T. Turner, "Special report: The Internet of Things for Precision Agriculture (IoT4Ag)", Computers and Electronics in Agriculture, vol. 196, pp. 106742, Jan-05-2022.

Struk, P., A. Billard, S. Bargiel, Q. Tanguy, C. Gorecki, R. Chutani, N. Passilly, and H. Xie, "The SS-OCT endomicroscopy probe based on MOEMS Mirau micro-interferometer for early stomach cancer detection", Optical Micro- and NanometrologyOptical Micro- and Nanometrology VII, Strasbourg, France, SPIE, 2018.

Son, S. Y., Y. Choi, P. Kumar, H. W. Park, T. Nishida, R. K. Singh, and S. Thompson, "Strain induced changes in gate leakage current and dielectric constant of nitrided Hf-silicate metal oxide semiconductor capacitors", Appl. Phys. Lett., vol. 93, pp. 153505-1–153505-3, OCT, 2008.

Yang, X., Y. Choi, J-S. Lim, T. Nishida, and S. Thompson, "Strain induced changes in the gate leakage current of n-channel metal-oxide-semiconductor field-effect transistors", J. Appl. Phys., vol. 109, pp. 9, 06/2011.

Sanchez, J. C., N. Alba, T. Nishida, C. Batich, and P. Carney, "Structural Modifications in Chronic Microwire Electrodes for Cortical Neuroprosthetics: A Case Study", IEEE Trans. Neural Systems and Rehab. Engr., vol. 14, no. 2, pp. 217-221, JUN, 2006.

Cheng, S., and D. P. Arnold, "A study of a multi-pole magnetic generator for low-frequency vibrational energy harvesting", J. Micromech. Microeng., vol. 20, no. 2, pp. 025015, 02/2010.

Taylor, R., F. Liu, S. Horowitz, K. Ngo, T. Nishida, L. Cattafesta, and M. Sheplak, "Technology Development for Electromechanical Acoustic Liners", Active 04 Paper a04-093, Williamsburg, VA, September, 2004.

Horowitz, S., A. Kasyap V.S., F. Liu, D. Johnson, T. Nishida, K. Ngo, M. Sheplak, and L. Cattafesta, "Technology Development for Self-Powered Sensors", 1st AIAA Flow Control Conference, AIAA Paper 2002-2702, St. Louis, MO, June, 2002.

Cassano, C. L., and K. Mawatari, "Thermal lens microscopy as a detector in microdevices", ELECTROPHORESIS, vol. 35, issue 16, pp. 2279 - 2291, 08/2014.

Cassano, C. L., and K. Mawatari, "Thermal lens microscopy as a detector in microdevices", ELECTROPHORESIS, vol. 35, issue 16, pp. 2279 - 2291, 08/2014.

Cassano, C.L., K. Mawatari, T. Kitamori, and Z.H. Fan, "Thermal Lens Microscopy as a Detector in Microdevices", Electrophoresis, vol. 35, no. 12, 02/2014.

Clingenpeel, T., S. Hwangbo, N. Garraud, D. P. Arnold, and Y-K. Yoon, "Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications", 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2018.

Chandrasekaran, V., M. Sheplak, L. Cattafesta, and B. V. Sankar, "Thermoelastic Actuation: Solution for Circular Composite Plates with Application in MEMS", International Mechanical Engineering Congress and Exposition, ASME Paper IMECE2002-39334, New Orleans, LA, November, 2002.

Chandrasekaran, V., M. Sheplak, L. Cattafesta, and B. V. Sankar, "Thermoelastic Actuation: Solution for Circular Composite Plates with Application in MEMS", International Mechanical Engineering Congress and Exposition, ASME Paper IMECE2002-39334, New Orleans, LA, November, 2002.

Griffin, B. A., V. Chandrasekaran, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Silicon Vias", Journal of Microelectromechanical Systems, vol. 21, no. 2, 04/2012.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.

Zhao, Y., Y.K. Yoon, S-O. Choi, X. Wu, Z. Liu, and M. G. Allen, "Three dimensional metal pattern transfer for replica molded microstructures", Applied Physics Letters, vol. 94, no. 2, 2009.

Fu, L., A. Jain, C. Cranfield, H. Xie, and M. Gu, "Three-dimensional nonlinear optical endoscopy", Journal of Biomedical Optics, vol. 12, no. 040501, 07/2007.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.