Publications

Martin, D., "Design, fabrication, and characterization of a MEMS dual-backplate capacitive microphone", Deparment of Electrical and Computer Engineering, vol. Ph.D., Gainesville, University of Florida, pp. 250, 2007.

Wang, Y., J. Li, P. Stoica, M. Sheplak, and T. Nishida, "Wideband RELAX and Wideband CLEAN for Aeroacoustic Imaging", J. Acoust. Soc. Am., vol. 115, no. 2, pp. 757-767, MAR, 2004.

Schultz, T., M. Sheplak, and L. Cattafesta, "Uncertainty analysis of the two-microphone method", J. Sound Vib., vol. 304, no. 1-2, pp. 91-109, JUL, 2007.

Griffin, B. A., V. Chandrasekaran, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Silicon Vias", Journal of Microelectromechanical Systems, vol. 21, no. 2, 04/2012.

Dieme, R., G. Bosman, M. Sheplak, and T. Nishida, "Source of Excess Noise in Silicon Piezoresistive Microphones", J. Acoustical Society of America, vol. 119, pp. 2710-2720, MAY, 2006.

Sheplak, M., E. Spina, and C. McGinley, "Progress in Hot-Film Anemometry for Hypersonic Flow", Experimental Thermal and Fluid Science, vol. 13, no. 1, pp. 21-28, JUL, 1996.

Dieme, R., J. Zhang, N. G. Rudawski, K. Jones, G. Bosman, M. Sheplak, and T. Nishida, "Process Dependence of 1/f Noise and Defects in Ion Implanted p-Type Piezoresistors", Journal of Applied Physics, vol. 112, 2012.

Chow, E., A. Partridge, V. Chandrasekaran, M. Sheplak, T. Nishida, C. Quate, and T. Kenny, "Process Compatible Polysilicon-Based Electrical Through-Wafer Interconnects In Silicon Substrates", J. Microelectromechanical Systems, vol. 11, no. 6, pp. 631-640, JUL, 2002.

Papila, M., R. T. Haftka, T. Nishida, and M. Sheplak, "Piezoresistive Microphone Design Pareto Optimization: Tradeoff between Sensitivity and Noise Floor", J. Microelectromechanical Systems, vol. 15, no. 6, pp. 1632-1643, DEC, 2006.

Li, X., E. Larsson, M. Sheplak, and J. Li, "Phase-Shift Based Time-Delay Estimators for Proximity Acoustic Sensors", IEEE Journal of Oceanic Engineering, vol. 27, no. 1, pp. 47-56, JUL, 2002.

Rogers, J. E., Y-K. Yoon, M. Sheplak, and J. W. Judy, "A Passive Wireless Microelectromechanical Pressure Sensor for Harsh Environments", Journal of Microelectromechanical Systems, vol. 27, issue 1, pp. 73 - 85, Jan-02-2018.

Mathew, J., Q. Song, B. V. Sankar, M. Sheplak, and L. Cattafesta, "Optimized Design of Piezoelectric Flap Actuators for Active Flow Control", AIAA Journal, vol. 44, no. 12, pp. 2919-2928, SEP, 2006.

Papila, M., M. Sheplak, and L. Cattafesta, "Optimization of Clamped Circular Piezoelectric Composite Actuators", Sensors & Actuators A, vol. 147, no. 1, pp. 310-323, SEP, 2008.

Liu, J., D. Martin, K. Kadirvel, T. Nishida, L. Cattafesta, M. Sheplak, and B. Mann, "Nonlinear Model and System Identification of a Capacitive Dual-Backplate MEMS Microphone", J. Sound Vib., vol. 309, no. 1-2, pp. 276-292, JAN, 2008.

Liu, F., S. Horowitz, T. Nishida, L. Cattafesta, and M. Sheplak, "A multiple degree of freedom electromechanical Helmholtz resonator", J. Acoust. Soc. Am., vol. 122, no. 1, pp. 291-301, JUL, 2007.

Guo, B., J. Li, H. Zmuda, and M. Sheplak, "Multifrequency Microwave-Induced Thermal Acoustic Imaging for Breast Cancer Detection", IEEE Trans. Bio. Eng., vol. 54, no. 11, pp. 2000-2010, NOV, 2007.

Li, X., R. Wu, M. Sheplak, and J. Li, "Multi-Frequency CW-Based Time Delay Estimation for Proximity Ultrasonic Sensors", IEE Proceedings: Radar, Sonar, and Navigation, vol. 149, no. 02, pp. 53-59, JUL, 2002.

Naughton, J., and M. Sheplak, "Modern Developments in Shear Stress Measurement", Progress in Aerospace Sciences, vol. 38, pp. 515-570, JUL, 2002.

Williams, M. D., F. Van Keulen, and M. Sheplak, "Modeling of Initially Curved Beam Structures for Design of Multistable MEMS", Journal of Applied Mechanics, vol. 79, no. 1, 01/2012.

Sawant, S. G., M. Oyarzun, M. Sheplak, L. Cattafesta, and D. P. Arnold, "Modeling of electrodynamic zero-net mass-flux actuators", AIAA Journal, vol. 50, no. 6, 06/2012.

Griffin, B. A., V. Chandrasekaran, M. D. Williams, B. V. Sankar, and M. Sheplak, "Model for thermoelastic actuation of an axisymmetric isotropic circular plate via an internal harmonic heat source", International Journal of Solids and Structures, 02/2011.

Schultz, T., L. Cattafesta, and M. Sheplak, "Modal decomposition method for acoustic impedance testing in square ducts", J. Acoust. Soc. Am., vol. 120, no. 6, pp. 3750-3758, DEC, 2006.

Appukuttan, A., W. Shyy, M. Sheplak, and L. Cattafesta, "Mixed Convection Induced by MEMS-Based Thermal Shear Stress Sensors", Numerical Heat Transfer-A, vol. 43, no. 3, pp. 283-305, JUL, 2003.

Chandrasekharan, V., J. Sells, J. Meloy, D. P. Arnold, and M. Sheplak, "A Microscale Differential Capacitive Direct Wall-Shear-Stress Sensor", Journal of Microelectromechanical Systems, vol. 20, no. 3, 06/2011.

Martin, D., J. Liu, K. Kadirvel, R. M. Fox, M. Sheplak, and T. Nishida, "A Micromachined Dual-Backplate Capacitive Microphone for Aeroacoustic Measurements", J. Microelectromechanical Systems, vol. 16, no. 6, pp. 1289-1302, DEC, 2007.