| Title | A Micromachined Dual-Backplate Capacitive Microphone for Aeroacoustic Measurements |
| Publication Type | Journal Article |
| Year of Publication | 2007 |
| Authors | Martin, D., J. Liu, K. Kadirvel, R. M. Fox, M. Sheplak, and T. Nishida |
| Journal | J. Microelectromechanical Systems |
| Volume | 16 |
| Pagination | 1289-1302 |
| Date Published | DEC |
| Abstract | This paper presents the development of a micromachined dual-backplate capacitive microphone for aeroacoustic measurements. The device theory, fabrication, and characterization are discussed. The microphone is fabricated using the five-layer planarized-polysilicon SUMMiT V process at Sandia National Laboratories. The microphone consists of a 0.46-mm-diameter 2.25-$muhbox{m}$-thick circular diaphragm and two circular backplates. The diaphragm is separated from each backplate by a 2-$ muhbox{m}$ air gap. Experimental characterization of the microphone shows a sensitivity of 390 $muhbox{V/Pa}$. The dynamic range of the microphone interfaced with a charge amplifier extends from the noise floor of 41 $hbox{dB}/sqrt{ hbox{Hz}}$ up to 164 dB and the resonant frequency is 178 kHz. |
| URL | http://dx.doi.org/10.1109/JMEMS.2007.909234 |
| DOI | 10.1109/JMEMS.2007.909234 |
