Publications

Found 88 results
Author Title Type [ Year(Asc)]
Filters: Author is Yoon, Yong-Kyu  [Clear All Filters]
2022
Kim, H-in., R. Bowrothu, W. Lee, C. Smith, L. Hayati, D. P. Arnold, and Y-K. Yoon, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Tokyo, Japan, IEEE, 2022.
2021
Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon, "3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
Kim, H-in., R. Bowrothu, and Y-K. Yoon, "Cu/Co metaconductor based coplanar waveguide with sub 0.1 dB/mm insertion loss at 28 GHz", 2021 IEEE/MTT-S International Microwave Symposium - IMS 20212021 IEEE MTT-S International Microwave Symposium (IMS), Atlanta, GA, USA, IEEE, 2021.
Lee, W., and Y-K. Yoon, "High Efficiency Metamaterial-based Multi-scale Wireless Power Transfer for Smart Home Applications", International Microwave Symposium 2021, 2021.
Lee, W., and Y-K. Yoon, "Rollable metamaterial screen for magnetic resonance coupling-based high-efficiency wireless power transferAbstract", International Journal of Microwave and Wireless Technologies, vol. 13, issue 4, pp. 365 - 373, Jan-05-2021.
Smith, C. S., R. Bowrothu, Y. Wang, F. Herrault, Y. K. Yoon, and D. P. Arnold, "Screen-Printable, Self-Biased SrM/PDMS Composites for Integrated Magnetic Microwave Devices", IEEE Transactions on Magnetics, vol. 57, issue 10, pp. 1 - 5, Jan-10-2021.
Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
2020
Bowrothu, R., H-in. Kim, C. S. Smith, D. P. Arnold, and Y-K. Yoon, "35-GHz Barium Hexaferrite/PDMS Composite-Based Millimeter-Wave Circulators for 5G Applications", IEEE Transactions on Microwave Theory and Techniques, vol. 68, issue 12, pp. 5065 - 5071, Jan-12-2020.
Lee, W., H. Kim, and Y-K. Yoon, "Metamaterial-inspired dual-function loop antenna for wireless power transfer and wireless communications", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2020.
Kim, H-in., R. Bowrothu, and Y-K. Yoon, "Tri-axis Polarized Loop Antenna for mmWave Wireless Inter/intra Chip Communications", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2020.
Lee, W., and Y-K. Yoon, "Tunable Metamaterial Slab for Efficiency Improvement in Misaligned Wireless Power Transfer", IEEE Microwave and Wireless Components Letters, vol. 30, issue 9, pp. 912 - 915, Jan-09-2020.
Lee, W., and Y-K. Yoon, "Wireless Power Transfer Systems Using Metamaterials: A Review", IEEE Access, vol. 8, pp. 147930 - 147947, Jan-01-2020.
2019
Chyczewski, S., S. Hwangbo, Y-K. Yoon, and D. P. Arnold, "Experimental demonstration of multi-watt wireless power transmission to ferrite-core receivers at 6.78 MHz", Wireless Power Transfer, vol. 6, issue 1, pp. 17 - 25, Jan-03-2019.
Kim, H-in., S. Hwangbo, R. Bowrothu, and Y-K. Yoon, "Highly Compact, Multiband Composite-Right/Left-Handed(CRLH) Transmission Line Based Stub for GPS Applications", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.
Hwangbo, S., R. Bowrothu, H-in. Kim, and Y-K. Yoon, "Integrated Compact Planar Inverted-F Antenna (PIFA) with a Shorting Via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.
Velez, C., S. Hwangbo, S. T. Chyczewski, J. Ewing, R. Bowrothu, C. S. Smith, Y-K. Yoon, and D. P. Arnold, "Investigation of Ferromagnetic Resonance Shift in Screen-Printed Barium Ferrite/Samarium Cobalt Composites", IEEE Transactions on Microwave Theory and Techniques, vol. 67, issue 8, pp. 3230 - 3236, Jan-08-2019.
Wang, Y., R. Bowrothu, Y-K. Yoon, and D. P. Arnold, "Patterning of thick electroplated CoPt magnets using SU-8 micromoulds", Micro & Nano Letters, vol. 14, issue 14, pp. 1393 - 1396, Jun-12-2020, 2019.
Bowrothu, R., S. Hwangbo, H. Kim, and Y-K. Yoon, "Quintuple Band Lambda/4 Stub by using Unbalanced Bridged CRLH Transmission Lines", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.
2018
Velez, C., J. Ewing, S. Hwangbo, K. Sondhi, T. Schumann, Y. K. Yoon, and D. P. Arnold, "Low-Temperature Micropatterning of Thick-Film BaFe12O19 Composites on Semiconductor Substrates for Integrated Millimeter Wave Devices", 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Ann Arbor, MI, IEEE, 2018.
Rogers, J. E., Y-K. Yoon, M. Sheplak, and J. W. Judy, "A Passive Wireless Microelectromechanical Pressure Sensor for Harsh Environments", Journal of Microelectromechanical Systems, vol. 27, issue 1, pp. 73 - 85, Jan-02-2018.
Clingenpeel, T., S. Hwangbo, N. Garraud, D. P. Arnold, and Y-K. Yoon, "Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications", 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2018.
2017
Hwangbo, S., A. Rahimi, and Y-K. Yoon, "Cu/Co metaconductor based high signal integrity transmission lines for millimeter wave applications", 2017 IEEE MTT-S International Microwave Symposium (IMS), Honololu, HI, USA, IEEE, 2017.
Hwangbo, S., S-P. Fang, H. An, Y-K. Yoon, A. B. Shorey, and A. M. Kazmi, "Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Kim, J., Y-K. Yoon, and M. G. Allen, "Double-side exposure UV-LED CNC lithography for fine 3D microfabrication", 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Los Angeles, CA, USA, IEEE, 2017.
Fang, S-P., S. Hwangbo, H. An, and Y. K. Yoon, "Fabrication and Characterization of Nanoporous Metallic Interconnects Using Electrospun Nanofiber Template and Electrochemical Deposition", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.