Publications

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D
Dai, X., L. Xi, C. Duan, H. Yang, H. Xie, and H. Jiang, "A tri-modal miniature probe for in vivo imaging", Optical Tomography and SpectroscopyBiomedical Optics 2016, Fort Lauderdale, FloridaWashington, D.C., OSA, pp. OTu4C.6, 2016.
Dai, X., L. Xi, C. Duan, H. Yang, H. Xie, and H. Jiang, "Miniature probe integrating optical-resolution photoacoustic microscopy, optical coherence tomography, and ultrasound imaging: proof-of-concept", Optics Letters, vol. 40, issue 12, pp. 2921, 2015.
Dabas, S., D. Mo, S. Rassay, and R. Tabrizian, "Intrinsically Tunable Laminated Ferroelectric Scandium Aluminum Nitride Extensional Resonator Based on Local Polarization Switching", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Tokyo, Japan, IEEE, 2022.
C
Cros, F., D. P. Arnold, M. G. Allen, S. Das, H. Koser, and J. H. Lang, "Micro-magnetic induction machines for portable power applications", Proc. Army Research Lab Collaborative Technology Alliances Conf., Power and Energy, College Park, MD, pp. 17-21, April, 2003.
Cremaschi, L., and S. Moghaddam, "Recent advances on heat and mass transfer in refrigeration and air-conditioning systems", Science and Technology for the Built Environment, vol. 23, issue 6, pp. 871 - 874, Jun-28-2017.
Correa, J., C. Crane, and H. Xie, "Kinematic Analysis and Design of a Compliant Microplatform", Proc. of the American Nuclear Society 2nd International Joint Topical Meeting on Emergency Preparedness & Response and Robotics & Remote Systems, 2008.
Correa, J., C. Crane, and H. Xie, "Kinematic Analysis of a Compliant Microplatform", ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering ConferenceVolume 2: 32nd Mechanisms and Robotics Conference, Parts A and B, Brooklyn, New York, USA, ASME, pp. 331 - 338, 2008.
Clingenpeel, T., S. Hwangbo, N. Garraud, D. P. Arnold, and Y-K. Yoon, "Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications", 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2018.
Clingenpeel, T., A. Rahimi, S. Hwangbo, Y.-K. Yoon, and A. Shorey, "Fabrication and characterization of advanced through glass via interconnects", International Symposium on Microelectronics, vol. 2016, issue 1, pp. 000288 - 000292, Feb-10-2016.
Clingenpeel, T., and Y-K. Yoon, "Reliability of Cu/NiFe and Cu/Ni Metaconductor Devices for RF Applications", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
Cleveland, C., M. E. Orazem, and S. Moghaddam, "Corrosion of Copper in De-Aerated Water by Impedance Spectroscopy", 223rd Electrochemical Society Meeting, Ontario, Canada, 05/2013.
Cleveland, C., S. Moghaddam, and M. E. Orazem, "Nanometer-Scale Corrosion of Copper in De-Aerated Deionized Water", Journal of The Electrochemical Society, vol. 161, issue 3, pp. C107 - C114, May-12-2015, 2014.
Cleveland, C., M. E. Orazem, and S. Moghaddam, "Response to “Comment on Nanometer-Scale Corrosion of Copper in De-Aerated Deionized Water”", Journal of The Electrochemical Society, vol. 163, issue 3, pp. Y5 - Y11, Oct-12-2016.
Chyczewski, S., S. Hwangbo, Y-K. Yoon, and D. P. Arnold, "Experimental demonstration of multi-watt wireless power transmission to ferrite-core receivers at 6.78 MHz", Wireless Power Transfer, vol. 6, issue 1, pp. 17 - 25, Jan-03-2019.
Chung, J., and S. Moghaddam, "Molecular Dynamics Simulation of Phases Interactions in Membrane-based Absorption and Desorption Processes", ASME 3rd Micro/Nanoscale Heat & Mass Transfer International Conference, Atlanta, GA, 03/2012.
Chugh, D., K. R. Gluesenkamp, O. Abdelaziz, and S. Moghaddam, "Hybrid Membrane-based Ionic Liquid Absorption Cycle for Water Heating, Dehumidification, and Cooling", 12th IEA Heat Pump Conference, Rotterdam, Netherlands, 2017.
Chugh, D., K. Gluesenkamp, O. Abdelaziz, and S. Moghaddam, "Ionic liquid-based hybrid absorption cycle for water heating, dehumidification, and cooling", Applied Energy, vol. 202, pp. 746 - 754, Jun-13-2017.
Chugh, D., K. R. Gluesenkamp, O. Abdelaziz, and S. Moghaddam, "Compact Membrane-based Hybrid Dehumidifier and Water Heater Absorption System", IVth International Symposium on Innovative Materials for Processes in Energy Systems, 2016.
Chugh, D., and S. Moghaddam, "Hybrid Absorption-based Water Heater Dehumidification System for Humid Climates", ASME HT/FE/ICNMM 2016, 2016.
Chu, M., T. Nishida, X. Lu, N. Mohta, and S. Thompson, "Comparison between high-field piezoresistive coefficients of Si metal-oxide-semiconductor field-effect transistors and bulk Si under uniaxial and biaxial stress", J. Appl. Phys., vol. 103, pp. 113704-1–113704-7, JUN, 2008.
Chu, M., A. D. Koehler, A. Gupta, T. Nishida, and S. Thompson, "Simulation of AlGaN/GaN high-electron-mobility transistor gauge factor based on two-dimnensional electron gas density and electron mobility", J. Appl. Phys. , vol. 108, pp. 6, 11/2010.
Chow, E., A. Partridge, V. Chandrasekaran, M. Sheplak, T. Nishida, C. Quate, and T. Kenny, "Process Compatible Polysilicon-Based Electrical Through-Wafer Interconnects In Silicon Substrates", J. Microelectromechanical Systems, vol. 11, no. 6, pp. 631-640, JUL, 2002.
Choi, Y., T. Numata, T. Nishida, R. Harris, and S. Thompson, "Impact of mechanical stress on gate tunneling currents of germanium and silicon p-type metal-oxide-semiconductor field-effect transistors and metal gate work function", J. Appl. Phys., vol. 103, pp. 064510-1–065410-5, MAR, 2008.
Choi, Y., J-S. Lim, T. Numata, T. Nishida, T. Nishida, and S. Thompson, "Mechanical stress altered electron gate tunneling current and extraction of conduction band deformation potentials for germanium", Journal of Applied Physics, vol. 102, pp. 104507-1–104507-5, DEC, 2007.
Choi, Y., T. Nishida, and S. Thompson, "Impact of mechanical stress on direct and trap-assisted gate leakage currents in p-type silicon metal-oxide-semiconductor capacitors", Appl. Phys. Lett., vol. 92, pp. 173507-1–173507-3, APR, 2008.