| Title | Reliability of Cu/NiFe and Cu/Ni Metaconductor Devices for RF Applications |
| Publication Type | Conference Paper |
| Year of Publication | 2017 |
| Authors | Clingenpeel, T., and Y-K. Yoon |
| Conference Name | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| Publisher | IEEE |
| Conference Location | Orlando, FL, USA |
| URL | http://ieeexplore.ieee.org/document/7999988/ |
| DOI | 10.1109/ECTC.2017.182 |
