Publications
Found 365 results
Author Title Type [ Year
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"Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.
, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
, "Valve-Enabled Sample Preparation and Isothermal Amplification for SARS-CoV-2 Detection at the Point-of-Care", International Mechanical Engineering Congress and Exposition, online, ASME, 2021.
, "Valve-Enabled Sample Preparation and Isothermal Amplification for SARS-CoV-2 Detection at the Point-of-Care", International Mechanical Engineering Congress and Exposition, online, ASME, 2021.
, "A Valve-Enabled Sample Preparation Device with Isothermal Amplification for Multiplexed Virus Detection at the Point-of-Care", ACS Sensors, vol. 6, pp. 4176–4184, 2021.
, "A Valve-Enabled Sample Preparation Device with Isothermal Amplification for Multiplexed Virus Detection at the Point-of-Care", ACS Sensors, vol. 6, pp. 4176–4184, 2021.
, "Valve-Enabled Sequential Reagent Delivery and Paper-Based Enrichment for Simultaneous Detection of SARS-CoV-2 and Influenza Viruses", International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS), Palm Springs, CA, pp. 837-838, 2021.
, "Valve-Enabled Sequential Reagent Delivery and Paper-Based Enrichment for Simultaneous Detection of SARS-CoV-2 and Influenza Viruses", International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS), Palm Springs, CA, pp. 837-838, 2021.
, "AlScN-on-SiC Thin Film Micromachined Resonant Transducers Operating in High-Temperature Environment up to 600 °C", ADVANCED FUNCTIONAL MATERIALS, June 21 2022.
, "Cu/Co Metaconductor Based Highly Energy-Efficient Bonding Wires for next Generation Millimeter wave Electronic Interconnects", 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022.
, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Tokyo, Japan, IEEE, 2022.
, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), 2022.
, "Effects of Ion-Induced Displacement Damage on GaN/AlN MEMS Resonators", IEEE TRANSACTIONS ON NUCLEAR SCIENCE, vol. 69, issue 3, January 14, 2022.
, "Effects of Ion-Induced Displacement Damage on GaN/AlN MEMS Resonators", IEEE TRANSACTIONS ON NUCLEAR SCIENCE, vol. 69, issue 3, January 14, 2022.
, "Intrinsically switchable dual‐band scandium‐aluminum nitride Lamb‐wave filter", physica status solidi (RRL) – Rapid Research Letters, Oct-08-2022.
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