Publications

Found 15 results
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Filters: Author is Venkataraman Chandrasekaran  [Clear All Filters]
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Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
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Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
Griffin, B. A., V. Chandrasekaran, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Silicon Vias", Journal of Microelectromechanical Systems, vol. 21, no. 2, 04/2012.
Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
Chandrasekaran, V., M. Sheplak, L. Cattafesta, and B. V. Sankar, "Thermoelastic Actuation: Solution for Circular Composite Plates with Application in MEMS", International Mechanical Engineering Congress and Exposition, ASME Paper IMECE2002-39334, New Orleans, LA, November, 2002.
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Chow, E., A. Partridge, V. Chandrasekaran, M. Sheplak, T. Nishida, C. Quate, and T. Kenny, "Process Compatible Polysilicon-Based Electrical Through-Wafer Interconnects In Silicon Substrates", J. Microelectromechanical Systems, vol. 11, no. 6, pp. 631-640, JUL, 2002.
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Horowitz, S., T-A. Chen, L. Cattafesta, M. Sheplak, T. Nishida, and V. Chandrasekaran, "Optical Flow Sensor Using Geometric Moire Interferometry", 34th International Conference on Environmental Systems, SAE Paper 2004-01-2267, Colorado Springs, CO, July, 2004.
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Griffin, B. A., B. Homeijer, V. Chandrasekaran, B. V. Sankar, and M. Sheplak, "A Nonlinear Model for the Large Deflections and Buckling of Circular Composite Diaphragms", 2005 ASME International Mechanical Engineering Congress & Exposition, November, 2005.
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Griffin, B. A., V. Chandrasekaran, M. D. Williams, B. V. Sankar, and M. Sheplak, "Model for thermoelastic actuation of an axisymmetric isotropic circular plate via an internal harmonic heat source", International Journal of Solids and Structures, 02/2011.
Horowitz, S., T-A. Chen, V. Chandrasekaran, K. Tedjojuwono, T. Nishida, L. Cattafesta, and M. Sheplak, "A Micromachined Geometric Moire Interferometric Floating-Element Shear Stress Sensor", 42nd Aerospace Sciences Meeting and Exhibit, AIAA Paper 2004-1042, Reno, NV, January, 2004.
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Kang, B., S. Kim, J. Kim, F. Ren, K. Baik, S. J. Pearton, B. P. Gila, C. Abernathy, C. Pan, G. Chen, et al., "Effect of External Strain on the Conductivity of AlGaN/GaN High-Electron-Mobility Transistors", Applied Physics Letters, vol. 83, no. 23, pp. 4845-4847, DEC, 2003.
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Chandrasekaran, V., A. Cain, T. Nishida, L. Cattafesta, and M. Sheplak, "Dynamic calibration technique for thermal shear-stress sensors", Experiments in Fluids, vol. 38, pp. 56-65, JUL, 2005.
Chandrasekaran, V., A. Cain, T. Nishida, and M. Sheplak, "Dynamic Calibration Technique for Thermal Shear Stress Sensors with Variable Mean Flow", 38th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2000-0508, Reno, NV, January, 2000.
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Chandrasekaran, V., A. Cain, T. Nishida, L. Cattafesta, and M. Sheplak, "Characterization of a Micromachined Thermal Shear Stress Sensor", 39th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2001-0247, Reno, NV, January, 2001.
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Chandrasekaran, V., B. V. Sankar, L. Cattafesta, T. Nishida, and M. Sheplak, "An Analytical Model for Thermoelastic Actuation of Composite Diaphragms", 12th International Conference on Solid-State Sensors and Actuators, Boston, MA, pp. 1844-1847, June, 2003.