Publications

Chai, J., H. Jia, X. Dong, C. Huang, L. Jiang, and H. Xie, "Trace Gas Detection Using a MEMS-Based Portable Fourier Transform Infrared Spectrometer", Fourier Transform SpectroscopyLight, Energy and the Environment 2018 (E2, FTS, HISE, SOLAR, SSL), SingaporeWashington, D.C., OSA, 2018.

Challa, V. R., and D. P. Arnold, "MEMS electrodynamic vibrational energy harvesters using multi-pole magnetic architectures", Tech. Dig. 12th Int. Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Apps. (PowerMEMS 2012), Atlanta, GA, IEEE, 12/2012.

Challa, V. R., J. Oscar Mur-Miranda, and D. P. Arnold, "Wireless power transmission to an electromechanical receiver using low-frequency magnetic fields", Smart Materials and Structures, vol. 21, issue 11, pp. 115017, 11/2012.

Challa, V. R., D. P. Arnold, and J. Oscar Mur-Miranda, "Electrodynamic wireless power transmission using low-frequency fields", 2nd Int. Workshop Wireless Energy Transport and Harvesting, Leuven, Belgium, 05/2012.

Challa, V. R., V. Divakar, J. Oscar Mur-Miranda, and D. P. Arnold, "Wireless power transmission to an electrodynamic energy harvester using low-frequency magnetic fields", Tech. Dig. 11th Int. Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Apps. (PowerMEMS 2011), Seoul, Korea, pp. pp. 335-338, 11/2011.

Challa, V. R., S. Cheng, and D. P. Arnold, "The role of coupling strength in the performance of electrodynamic vibrational energy harvesters", Smart Materials and Structures, vol. 22, issue 2, pp. 025005, 02/2013.

Chandrasekaran, V., M. Sheplak, L. Cattafesta, and B. V. Sankar, "Thermoelastic Actuation: Solution for Circular Composite Plates with Application in MEMS", International Mechanical Engineering Congress and Exposition, ASME Paper IMECE2002-39334, New Orleans, LA, November, 2002.

Chandrasekaran, V., A. Cain, T. Nishida, L. Cattafesta, and M. Sheplak, "Dynamic calibration technique for thermal shear-stress sensors", Experiments in Fluids, vol. 38, pp. 56-65, JUL, 2005.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, and M. Sheplak, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.

Chandrasekaran, V., A. Cain, T. Nishida, L. Cattafesta, and M. Sheplak, "Characterization of a Micromachined Thermal Shear Stress Sensor", 39th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2001-0247, Reno, NV, January, 2001.

Chandrasekaran, V., B. V. Sankar, L. Cattafesta, T. Nishida, and M. Sheplak, "An Analytical Model for Thermoelastic Actuation of Composite Diaphragms", 12th International Conference on Solid-State Sensors and Actuators, Boston, MA, pp. 1844-1847, June, 2003.

Chandrasekaran, V., A. Cain, T. Nishida, and M. Sheplak, "Dynamic Calibration Technique for Thermal Shear Stress Sensors with Variable Mean Flow", 38th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2000-0508, Reno, NV, January, 2000.

Chandrasekaran, V., E. Chow, T. Kenny, T. Nishida, L. Cattafesta, B. V. Sankar, and M. Sheplak, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.

Chandrasekharan, V., J. Naughton, and M. Sheplak, "Shear Stress Measurements", Encyclopedia of Aerocpace Engineering, 1, vol. 1, 2010.

Chandrasekharan, V., J. Sells, D. P. Arnold, and M. Sheplak, "Effect of dynamic pressure on direct shear stress sensor design", 48th AIAA Aerospace Sciences Meeting, AIAA Paper 2010-004, 01/2010.

Chandrasekharan, V., J. Sells, J. Meloy, D. P. Arnold, and M. Sheplak, "A Metal-On-Silicon Differential Capacitive Shear Stress Sensor", Tech. Dig. 15th Int. Conf. Solid-State Sensors, Actuators, and Microsystems (Transducers 2009), Denver, CO, June, 2009.

Chandrasekharan, V., M. Sheplak, and L. Cattafesta, "Experimental Study of Acoustic Impedance of MEMS-Based Micro-Perforated Liners", 12th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2006-2401, Cambridge, MA, May, 2006.

Chandrasekharan, V., J. Sells, J. Meloy, D. P. Arnold, and M. Sheplak, "A Microscale Differential Capacitive Direct Wall-Shear-Stress Sensor", Journal of Microelectromechanical Systems, vol. 20, no. 3, 06/2011.

Chandrasekharan, V., J. Sells, J. Meloy, D. P. Arnold, and M. Sheplak, "A MEMS Direct Skin Friction Sensor", Florida Center for Advanced Aero-Propulsion, FCAAP Annual Symposium and Exhibition, 08/2010.

Chandrasekharan, V., J. Sells, D. P. Arnold, and M. Sheplak, "Characterization of a MEMS-Based Floating Element Shear Stress Sensor", 47th AIAA Aerospace Sciences Meeting and Exhibit, Orlando, FL, 01/2009.

Chao, J., W. Shyy, S. Thakur, M. Sheplak, and R. Mei, "Effect of Conjugate Heat Transfer on MEMS-Based Thermal Shear Stress Sensor", Numerical Heat Transfer-A, vol. 48, no. 3, pp. 197-217, AUG, 2005.

Chen, F., H. Xie, and G. K. Fedder, "A MEMS-Based Monolithic Electrostatic Microactuator for Ultra-Low Magnetic Disk Head Fly Height Control", IEEE Transaction on Magnetics, vol. 37, no. 4, pp. 1915-1918, JUL, 2001.

Chen, H., M. Li, Y. Zhang, H. Xie, C. Chen, Z. Peng, and S. Su, "H∞ Robust Control of a Large-Piston MEMS Micromirror for Compact Fourier Transform Spectrometer Systems", Sensors, vol. 18, issue 2, pp. 508, Jan-02-2018.

Chen, K., T. Georgiev, and H. Z. Fan, "Interactions Between Circulating Tumor Cells and Aptamer-Functionalized Microposts in a Flow", ASME 2017 International Mechanical Engineering Congress and Exposition, Tampa, Florida, USA, ASME, 2017.

Chen, Q., H. Zhang, X. Zhang, D. Xu, and H. Xie, "Repeatability study of 2D MEMS mirrors based on S-shaped Al/SiO2 bimorphs", Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on, pp. 817-820, April, 2013.