Publications

Found 9 results
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Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon, "3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.
Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon, "3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
D
Kim, H-in., R. Bowrothu, W. Lee, C. Smith, L. Hayati, D. P. Arnold, and Y-K. Yoon, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Tokyo, Japan, IEEE, 2022.
M
Lee, W., H. Kim, and Y-K. Yoon, "Metamaterial-inspired dual-function loop antenna for wireless power transfer and wireless communications", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2020.
R
Lee, W., and Y-K. Yoon, "Rollable metamaterial screen for magnetic resonance coupling-based high-efficiency wireless power transferAbstract", International Journal of Microwave and Wireless Technologies, vol. 13, issue 4, pp. 365 - 373, Jan-05-2021.
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Lee, W., and Y-K. Yoon, "Tunable Metamaterial Slab for Efficiency Improvement in Misaligned Wireless Power Transfer", IEEE Microwave and Wireless Components Letters, vol. 30, issue 9, pp. 912 - 915, Jan-09-2020.
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Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
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Lee, W., and Y-K. Yoon, "Wireless Power Transfer Systems Using Metamaterials: A Review", IEEE Access, vol. 8, pp. 147930 - 147947, Jan-01-2020.