Publications
Found 15 results
Author [ Title] Type Year Filters: Author is Venkataraman Chandrasekaran [Clear All Filters]
"An Analytical Model for Thermoelastic Actuation of Composite Diaphragms", 12th International Conference on Solid-State Sensors and Actuators, Boston, MA, pp. 1844-1847, June, 2003.
, "Characterization of a Micromachined Thermal Shear Stress Sensor", 39th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2001-0247, Reno, NV, January, 2001.
, "Dynamic Calibration Technique for Thermal Shear Stress Sensors with Variable Mean Flow", 38th AIAA Aerospace Sciences Meeting & Exhibit, AIAA Paper 2000-0508, Reno, NV, January, 2000.
, "Dynamic calibration technique for thermal shear-stress sensors", Experiments in Fluids, vol. 38, pp. 56-65, JUL, 2005.
, "Effect of External Strain on the Conductivity of AlGaN/GaN High-Electron-Mobility Transistors", Applied Physics Letters, vol. 83, no. 23, pp. 4845-4847, DEC, 2003.
, "A Micromachined Geometric Moire Interferometric Floating-Element Shear Stress Sensor", 42nd Aerospace Sciences Meeting and Exhibit, AIAA Paper 2004-1042, Reno, NV, January, 2004.
, "Model for thermoelastic actuation of an axisymmetric isotropic circular plate via an internal harmonic heat source", International Journal of Solids and Structures, 02/2011.
, "A Nonlinear Model for the Large Deflections and Buckling of Circular Composite Diaphragms", 2005 ASME International Mechanical Engineering Congress & Exposition, November, 2005.
, "Optical Flow Sensor Using Geometric Moire Interferometry", 34th International Conference on Environmental Systems, SAE Paper 2004-01-2267, Colorado Springs, CO, July, 2004.
, "Process Compatible Polysilicon-Based Electrical Through-Wafer Interconnects In Silicon Substrates", J. Microelectromechanical Systems, vol. 11, no. 6, pp. 631-640, JUL, 2002.
, "Thermoelastic Actuation: Solution for Circular Composite Plates with Application in MEMS", International Mechanical Engineering Congress and Exposition, ASME Paper IMECE2002-39334, New Orleans, LA, November, 2002.
, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Wafer Interconnects", Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 102-107, June, 2002.
, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Silicon Vias", Journal of Microelectromechanical Systems, vol. 21, no. 2, 04/2012.
, "Through Wafer Electrical Interconnects for MEMS Sensors", Proceedings of ASME IMECE 2001, International Mechanical Engineering Congress and Exposition, Paper MEMS-23846, vol. 2, New York, NY, November, 2001.
, "A Wafer-Bonded, Floating Element Shear-Stress Sensor", Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head, SC, pp. 13-18, June, 2004.
,