Publications

Found 12 results
Author Title Type [ Year(Asc)]
Filters: Author is Kim, Hae-in  [Clear All Filters]
2022
Kim, H-in., R. Bowrothu, W. Lee, C. Smith, L. Hayati, D. P. Arnold, and Y-K. Yoon, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Tokyo, Japan, IEEE, 2022.
2021
Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon, "3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.
Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon, "3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
Bowrothu, R., H-in. Kim, C. Smith, X. N. Guan, S. Cui, F. Herrault, D. P. Arnold, and Y. Kyu Yoon, "Batch-Fabricated Substrate-Embedded K a Band Self-Biased Circulators Using Screen-Printed Strontium Hexaferrite/PDMS Composite", 2021 IEEE/MTT-S International Microwave Symposium - IMS 20212021 IEEE MTT-S International Microwave Symposium (IMS), Atlanta, GA, USA, IEEE, 2021.
Kim, H-in., R. Bowrothu, and Y-K. Yoon, "Cu/Co metaconductor based coplanar waveguide with sub 0.1 dB/mm insertion loss at 28 GHz", 2021 IEEE/MTT-S International Microwave Symposium - IMS 20212021 IEEE MTT-S International Microwave Symposium (IMS), Atlanta, GA, USA, IEEE, 2021.
Bowrothu, R., H-in. Kim, Y. Kyu Yoon, S. Schmidt, and R. Santos, "Low Loss Cu/Co Multilayer Metaconductor Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
Bowrothu, R., H-in. Kim, C. S. Smith, D. P. Arnold, and Y. Kyu Yoon, "Magnetically Tunable 28 GHz Array Antenna Using BaM/PDMS Composite", 2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI)2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI), Singapore, Singapore, IEEE, 2021.
Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
2020
Bowrothu, R., H-in. Kim, C. S. Smith, D. P. Arnold, and Y-K. Yoon, "35-GHz Barium Hexaferrite/PDMS Composite-Based Millimeter-Wave Circulators for 5G Applications", IEEE Transactions on Microwave Theory and Techniques, vol. 68, issue 12, pp. 5065 - 5071, Jan-12-2020.
Kim, H-in., R. Bowrothu, and Y-K. Yoon, "Tri-axis Polarized Loop Antenna for mmWave Wireless Inter/intra Chip Communications", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2020.
2019
Kim, H-in., S. Hwangbo, R. Bowrothu, and Y-K. Yoon, "Highly Compact, Multiband Composite-Right/Left-Handed(CRLH) Transmission Line Based Stub for GPS Applications", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.
Hwangbo, S., R. Bowrothu, H-in. Kim, and Y-K. Yoon, "Integrated Compact Planar Inverted-F Antenna (PIFA) with a Shorting Via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2019.