| Title | Low Loss Cu/Co Multilayer Metaconductor Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology |
| Publication Type | Conference Paper |
| Year of Publication | 2021 |
| Authors | Bowrothu, R., H-in. Kim, Y. Kyu Yoon, S. Schmidt, and R. Santos |
| Conference Name | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| Publisher | IEEE |
| Conference Location | San Diego, CA, USA |
| URL | https://ieeexplore.ieee.org/document/9501869/http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501869.pdf?arnumber=9501869 |
| DOI | 10.1109/ECTC32696.2021.00192 |
