Publications

Found 8 results
Author [ Title(Desc)] Type Year
Filters: Author is Jiping Li  [Clear All Filters]
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D
Tseng, V.F.-G., J. Li, X. Zhang, and H. Xie, "Design and fabrication of an electromagnetically actuated optical switch with precise tilt angle control", Optical MEMS and Nanophotonics (OMN), 2013 International Conference on, pp. 67-68, Aug, 2013.
E
Tseng, V. Farm- Guoo, J. Li, X. Zhang, J. Ding, Q. Chen, and H. Xie, "An electromagnetically actuated micromirror with precise angle control for harsh environment optical switching applications", Sensors and Actuators A: Physical, vol. 206, pp. 1 - 9, 2/2014.
H
Li, J., V. Tseng, Z. Xiao, and H. Xie, "A High-Q In-Silicon Power Inductor Designed for Wafer-Level Integration of Compact DC-DC Converters", IEEE Transactions on Power Electronics, pp. 1 - 1, 2016.
N
Wang, M., J. Li, K. Ngo, and H. Xie, "A novel integrated power inductor in silicon substrate for ultra-compact power supplies", 2010 IEEE Applied Power Electronics Conference and Exposition - APEC 20102010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Palm Springs, CA, USA, IEEE, pp. 2036 - 2041, 2010.
S
Wang, M., J. Li, K. Ngo, and H. Xie, "Silicon Molding Techniques for Integrated Power MEMS Inductors", Sensors & Actuators: A. Physical, 2010.
Wang, M., J. Li, K. Ngo, and H. Xie, "A Surface Mountable Micro-Fabricated Power Inductor in Silicon for Ultra-Compact Power Supplies", IEEE Transactions on Power Electronics, 2010.
W
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.