| Title | Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique |
| Publication Type | Conference Paper |
| Year of Publication | 2012 |
| Authors | Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie |
| Conference Name | Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on |
| Date Published | March |
| Keywords | copper, deep silicon trenches, dielectric material, dielectric materials, electroplating, elemental semiconductors, frequency 14 MHz, high-power-density MEMS passives, Inductors, magnetic core, Magnetic cores, magnetic powder, MEMS fabrication technology, micromechanical devices, moulding, polyimide, Polyimides, polymer, polymers, Q factor, Silicon, silicon molding technique, silicon substrate, size 200 micron, size 60 micron, Substrates, three-dimensional integrated circuits, through-silicon vias, toroidal inductor, toroidal transformer, toroidal windings, TSV, wafer-level fabrication, Windings |
