Publications

Found 8 results
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Filters: Author is Jiping Li  [Clear All Filters]
Conference Paper
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.
Li, J., K. D. T. Ngo, G-Q. Lu, and H. Xie, "Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique", Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-5, March, 2012.
Wang, M., J. Li, K. Ngo, and H. Xie, "A novel integrated power inductor in silicon substrate for ultra-compact power supplies", 2010 IEEE Applied Power Electronics Conference and Exposition - APEC 20102010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Palm Springs, CA, USA, IEEE, pp. 2036 - 2041, 2010.
Tseng, V.F.-G., J. Li, X. Zhang, and H. Xie, "Design and fabrication of an electromagnetically actuated optical switch with precise tilt angle control", Optical MEMS and Nanophotonics (OMN), 2013 International Conference on, pp. 67-68, Aug, 2013.