Publications

Found 23 results
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Bauer, M. J., A. Thomas, B. Isenberg, J. Varela, A. Faria, D. P. Arnold, and J. S. Andrew, "Ultra-Low-Power Current Sensor Utilizing Magnetoelectric Nanowires", IEEE Sensors Journal, vol. 20, issue 10, pp. 5139 - 5145, Mar-05-2021, 2020.
Bernard, B. P., J. W. Peyser, B. Mann, and D. P. Arnold, "Using the mass ratio to induce band gaps in a 1D array of nonlinearly coupled oscillators", Proc. ASME 2012 Int. Design Engineering Tech. Conf. & Computers and Information in Eng. Conf. (IDETC/CIE 2012), Chicago, IL, ASME, 08/2012.
C
Cassano, C. L., T. Z. Georgiev, and H. Z Fan, "Using airbrushes to pattern reagents for microarrays and paper-fluidic devices", Microsystems & Nanoengineering, vol. 3, pp. 17055, Nov-20-2017.
Cassano, C. L., A. J. Simon, W. Liu, C. Fredrickson, and H. Z. Fan, "Use of vacuum bagging for fabricating thermoplastic microfluidic devices", Lab Chip, vol. 15, issue 1, pp. 62 - 66, 2015.
Chen, Q., H. Guo, T. Jin, W. Qi, H. Xie, and L. Xi, "Ultracompact high-resolution photoacoustic microscopy", Optics Letters, vol. 43, issue 7, pp. 1615, Jan-01-2018.
K
Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.
Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.
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Li, C.Y., G.M. Li, V.O.K. Li, P.K.A. Wai, H. Xie, and X.C. Yuan, "Using 2 x 2 switching modules to build large 2-D MEMS optical switches", GLOBECOM '03. IEEE Global Telecommunications Conference (IEEE Cat. No.03CH37489)GLOBECOM '03. IEEE Global Telecommunications Conference (IEEE Cat. No.03CH37489), vol. 5, San Fransico, CA, USA, IEEE, pp. 2798 - 2802, 2003.
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Manzanas, C., X. Jiang, J. C. Loeb, J. A. Lednicky, and H. Z. Fan, "Use of Miniaturized Devices and Isothermal Amplification for Pathogen Detection in the Field", International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS), Basel, Switzerland, pp. 831-832, 2019.
Meyer, C. D., S. S. Bedair, B. C. Morgan, and D. P. Arnold, "Ultra-miniaturized power converter modules using micromachined copper scaffolds", Hilton Head 2012, Hilton Head Island, SC, 06/2012.
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Schultz, T., L. Cattafesta, T. Nishida, and M. Sheplak, "Uncertainty Analysis of the Two-Microphone Method", 8th AIAA/CEAS Aeroacoustics Conference, AIAA Paper 2002-2465, June, 2002.
Schultz, T., M. Sheplak, and L. Cattafesta, "Uncertainty analysis of the two-microphone method", J. Sound Vib., vol. 304, no. 1-2, pp. 91-109, JUL, 2007.
T
Thompson, S., G-Y. Sun, Y. Choi, and T. Nishida, "Uniaxial Process Induced Strained Si: Extending the CMOS Roadmap", IEEE Trans. Electron Dev., vol. 53, pp. 1010-1020, MAY, 2006.
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Wang, Y., J. Ewing, and D. P. Arnold, "Ultra-Thick Electroplated CoPt Magnets for MEMS", Journal of Microelectromechanical Systems, vol. 28, issue 2, pp. 311 - 320, Jan-04-2019.
Wang, D., X. Zhang, L. Zhou, M. Liang, D. Zhang, and H. Xie, "An ultra-fast electrothermal micromirror with bimorph actuators made of copper/tungsten", 2017 International Conference on Optical MEMS and Nanophotonics (OMN)2017 International Conference on Optical MEMS and Nanophotonics (OMN), Santa Fe, NM, USA, IEEE, 2017.
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Zhang, J., and H. Z. Fan, "A universal tumor cell isolation method enabled by fibrin-coated microchannels", The Analyst, vol. 141, issue 2, pp. 563 - 566, 2016.