Publications

Found 4 results
Author Title Type [ Year(Asc)]
Filters: Author is Clingenpeel, Timothy  [Clear All Filters]
2018
Clingenpeel, T., S. Hwangbo, N. Garraud, D. P. Arnold, and Y-K. Yoon, "Thermal Stability of Cu/Co Metaconductor and Its Millimeter Wave Applications", 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2018.
2017
Yoon, Y. K., S. Hwangbo, T. Clingenpeel, and A. Rahimi, "Recent Advancement on Low Loss Meta-conductor Technology for Energy Effi-cient 5G and Millimeter Wave Applica-tions", 2017 Microprocessors and Nanotechnology Conference (MNC), Jeju, South Korea, 2017.
Clingenpeel, T., and Y-K. Yoon, "Reliability of Cu/NiFe and Cu/Ni Metaconductor Devices for RF Applications", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
2016
Clingenpeel, T., A. Rahimi, S. Hwangbo, Y.-K. Yoon, and A. Shorey, "Fabrication and characterization of advanced through glass via interconnects", International Symposium on Microelectronics, vol. 2016, issue 1, pp. 000288 - 000292, Feb-10-2016.