Publications
"A Nonlinear Model for the Large Deflections and Buckling of Circular Composite Diaphragms", 2005 ASME International Mechanical Engineering Congress & Exposition, November, 2005.
, "The Nonlinear Behavior of a Post-Buckled Circular Plate", 6th IEEE Conference on Sensors, October, 2007.
, "Vibration of Post-Buckled Homogeneous Circular Plates", IEEE Ultrasonics Symposium, 2007: IEEE, October, 2007.
, "Large Deflections of Clamped Composite Circular Plates with Initial In-Plane Tension", IMAC XXVI, A Conference and Exposition on Structural Dynamics, Orlando, FL, February, 2008.
, "An Aluminum Nitride Piezoelectric Microphone for Aeroacoustics Applications", Hilton Head 2010: A Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, SC, Transducer Research Foundation, Inc., 06/2010.
, "Sapphire Sensors for High Temperature Applications", Florida Center for Advanced Aero-Propulsion Annual Technical Symposium, Tallahassee, FL, 08/2010.
, "Aluminum Nitride Ultrasonic Air-Coupled Actuator ", Journal of Microelectromechanical Systems, vol. 20, no. 2, pp. 476-486, 04/2011.
, "Evaluation of Optical Fiber Positioning using Silicon V-Grooves", 39th North American Manufacturing Research Conference, Corvallis, OR, 2011.
, "Model for thermoelastic actuation of an axisymmetric isotropic circular plate via an internal harmonic heat source", International Journal of Solids and Structures, 02/2011.
, "A Sapphire Based Fiber Optic Dynamic Pressure Sensor for Harsh Environments: Fabrication and Characterization", 49th AIAA Aerospace Sciences Meeting, Orlando, FL, AIAA, 01/2011.
, "An AlN MEMS Piezoelectric Microphone for Aeroacoustic Applications", Journal of Microelectromechanical Systems, vol. 21, no. 2, 04/2012.
, "Characterization of Aeroacoustic MEMS Microphones for Aircraft Fuselage Arrays", AIAA Journal, vol. 50, pp. 2744-2752, 12/2012.
, "Composite Circular Plates with Residual Tensile Stress Undergoing Large Deflections", Journal of Applied Mechanics, vol. 79, no. 2: ASME, 03/2012.
, "Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Through-Silicon Vias", Journal of Microelectromechanical Systems, vol. 21, no. 2, 04/2012.
, "The electromechanical behavior of piezoelectric thin film composite diaphragms possessing in-plane stresses", Journal of Micromechanics and Microengineering, vol. 27, issue 4, pp. 045017, Jan-04-2017.
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