The electromechanical behavior of piezoelectric thin film composite diaphragms possessing in-plane stresses

TitleThe electromechanical behavior of piezoelectric thin film composite diaphragms possessing in-plane stresses
Publication TypeJournal Article
Year of Publication2017
AuthorsGriffin, B. A., M. D. Williams, G. Wang, B. V. Sankar, L. N. Cattafesta, and M. Sheplak
JournalJournal of Micromechanics and Microengineering
Volume27
Issue4
Pagination045017
Date PublishedJan-04-2017
ISSN0960-1317
URLhttp://iopscience.iop.org/article/10.1088/1361-6439/aa62b3
DOI10.1088/1361-6439/aa62b3
Short TitleJ. Micromech. Microeng.