Publications
"Directional through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2017.
, "Fabrication and characterization of advanced through glass via interconnects", International Symposium on Microelectronics, vol. 2016, issue 1, pp. 000288 - 000292, Feb-10-2016.
, "Glass interposer integrated dual-band millimeter wave TGV antenna for inter-/intra chip and board communications", 2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Fajardo, PR, USA, IEEE, 2016.
, "In-Substrate Resonators and Bandpass Filters with Improved Insertion Loss in K-Band Utilizing Low Loss Glass Interposer Technology and Superlattice Conductors", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.
, "Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.
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