| Title | Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas |
| Publication Type | Conference Paper |
| Year of Publication | 2016 |
| Authors | Hwangbo, S., A. B. Shorey, and Y.-K. Yoon |
| Conference Name | 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| Publisher | IEEE |
| Conference Location | Las Vegas, NV, USA |
| URL | http://ieeexplore.ieee.org/document/7545778/ |
| DOI | 10.1109/ECTC.2016.278 |
