Publications

Found 12 results
Author Title Type [ Year(Desc)]
Filters: Author is Yong-Kyu Yoon  [Clear All Filters]
2019
Lee, W., and Y-K. Yoon, "Experimental investigation of wireless power transfer with metamaterial,", UKC 2019, 2019.
2020
Bowrothu, R., H-in. Kim, C. S. Smith, D. Arnold, and Y-K. Yoon, 35-GHz Barium Hexaferrite/PDMS Composite-Based Millimeter-Wave Circulators for 5G Applications, 2020.
Lee, W., and Y-K. Yoon, "Dual-functional metamaterial-integrated antenna for wireless power transfer and wireless communications", UKC 2020, 2020.
Lee, W., H-in. Kim, and Y-K. Yoon, "Metamaterial-inspired dual-function loop antenna for wireless power transfer and wireless communications", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020.
2021
Lee, W., H-in. Kim, S. Hwang, S. Jeon, H. Cho, and Y-K. Yoon, "3D integrated high gain rectenna in package with metamaterial superstrates for high efficiency wireless power transfer applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.
Cho, H., W. Lee, and Y-K. Yoon, "Highly Compact Array MIMO Module for EMI Immune 5G Wireless Communications", International Microwave Symposium 2021, 2021.
Bowrothu, R., H-in. Kim, C. S. Smith, D. P. Arnold, and Y-K. Yoon, "Magnetically Tunable 28 GHz Array Antenna Using BaM/PDMS Composite", 2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI), 2021.
Lee, W., S-il. Choi, H-in. Kim, S. Hwang, S. Jeon, and Y-K. Yoon, Metamaterial-Integrated High-Gain Rectenna for RF Sensing and Energy Harvesting Applications, 2021.
Kim, H-in., R. Bowrothu, W. Lee, and Y-K. Yoon, "Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.
2022
Jeon, S., H-in. Kim, W. Lee, and Y-K. Yoon, "Cu/Co Metaconductor Based Highly Energy-Efficient Bonding Wires for next Generation Millimeter wave Electronic Interconnects", 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022.
Kim, H-in., D. P. Arnold, and Y-K. Yoon, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), 2022.
Kim, H-in., "Metaconductor Based Highly Energy Efficient Differential Striplines for 112 Gbps Data Bus With Sub 0.1 dB/mm Package Insertion Loss", 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022.