Magnetic Thick Films for Integrated Microwave Devices

This project is under DARPA's Magnetic Miniaturized and Monolithically Integrated Components (M3IC) program in the DARPA Microsystems Technology Office.

The objective of this effort is to develop thick-film magnetic materials that can be fabricated on semiconductor integrated circuits to enable highly miniaturized microwave components such as circulators and isolators operating in the 10 to 110 GHz frequency regime. These nonlinear, non-reciprocal components are critical for next generation radios, radar, and sensing systems for defense, consumer, automotive, and healthcare applications.

Specific efforts include: (1) self-biased microwave magnetic thick-films on semiconductor substrates, (2) integration of permanent magnet bias magnets on semiconductor substrates, and (3) integrated microwave magnetic components on semiconductor substrates.

Start date: 
Wednesday, February 1, 2017
Project status: