Distinguished publication

Congratulations to Tahmid Kaisar and Dr. Feng on Physical Review Letters Publication!

Congratulations to IMG Ph.D. student, Tahmid Kaisar, and IMG Professor, Dr. Philip Feng, for their research article, “Parametric Frequency Divider Based Ising Machines”, recently published in Physical Review Letters. In this work, they report on a new class of Ising machines (IMs) that rely on coupled parametric frequency dividers (PFDs) as macroscopic artificial spins.

Congratulations to Sunghyun Hwang and Professor Yoon on their IEEE Photonics Technology Letters publication!

Congratulations to IMG Member Sunghyun Hwang and IMG Professor Yong-Kyu Yoon, on their recent publication in the journal IEEE Photonics Technology Letters! In this work, titled, “Silicon Phononic Nanowires Enable Ultra-Low Thermal Conductivity Measured by Raman Spectroscopy”, a novel device structure and precise measurement technique were introduced to assess the thermal conductivity of PnC-supported Si MEMS pixels using vacuum-based Raman spectroscopy.

Congratulations to Dr. Xin Tang, Keming Li, Miao Huang, and Chenyu Liang on their Oncogene publication!

Congratulations to IMG Professor, Dr. Xin Tang, and IMG Members, Keming Li, Miao Huang, and Chenyu Liang, on their recent publication in the journal Oncogene! This work, titled “Biophysics in tumor growth and progression: from single mechano-sensitive molecules to mechanomedicine”, highlights cancer mechanics ranging from molecular and cellular level to tissue level and clarifies functional crosstalk between mechanotransduction and oncogenic signaling.

Congratulations to Faysal Hakim and Dr. Tabrizian on Nature Electronics Publication!

Congratulations to IMG member Faysal Hakim from Tabrizian Group on his recent Nature Electronics publication titled “A ferroelectric-gate fin microwave acoustic spectral processor.”

In this article, Faysal and co-authors have demonstrated how extending the active area of nano-acoustic resonators to the third dimension enables extensive benefits for frequency scaling, massive arraying, and integration.

Congratulations to Suhas and Dr. Moghaddam on their Applied Thermal Engineering publication!

Congratulations to IMG Members Suhas Tamvada and Dr. Saeed Moghaddam on their recent publication in Applied Thermal Engineering! Titled “Data Center energy efficiency enhancement potential of a membrane-assisted phase-change heat sink”, This work demonstrates a new cooling technology which can help decarbonize Data Centers by efficiently cooling electronic chips.

Suhas and Dr. Moghaddam's Influential Work Featured on UF MAE Homepage!

Congratulations to IMG Member Suhas Tamvada and Dr. Saeed Moghaddam on their recent major discovery in nucleate boiling science! As featured on the UF MAE homepage, their research showed it is possible to overcome the limit of hydrodynamic instability to establish a flow condition in which the evaporation momentum limit is the ultimate limit.

IMG Members' NEMS Research Featured as Cover of Applied Physics Letters 1st Issue in 2022

The cover of Applied Physics Letters' first issue of 2022 features the work of IMG members Dr. Jaesung Lee and Prof. Philip Feng and their collaborator. In the article, “Design of strongly nonlinear graphene nanoelectromechanical systems in quantum regime,” the authors show that atomically thin nonlinear nanoelectromechanical systems (NEMS) can offer sufficient anharmonicity for quantum NEMS to behave like artificial atoms, thus feasible to enable qubit devices with much smaller footprints than today’s qubit hardware.

IMG Journal Article Selected as Cover for Advanced Engineering Materials December Issue

The recent article titled, "Resolving Mechanical Properties and Morphology Evolution of Free-Standing Ferroelectric Hf0.5Zr0.5O2" targets the accurate extraction of Young's modulus, built-in stress, and crystal morphology change upon release of hafnia-zirconia thin films. Hafnia-zirconia is uniquely positioned to revolutionize nanoscale transducers, allowing for nanomechanical sensors and actuators to be monolithically integrated within CMOS.