Liang Zhou will defend his dissertation entitled "Electrothermal MEMS Scanning Mirrors and Lenses with Large Range and High Robustness for Two-Photon Microscopy" at 03:00 pm on Wednesday, August 12th.
Join Zoom Meeting
https://ufl.zoom.us/j/7380294173?pwd=ZmlyUUlPUmtQalkrYmcybnladGtDQT09
Meeting ID: 738 029 4173
Passcode: 434254
IMG will be represented this week at the IEEE IFCS / ISAF 2020.
Thickness Scaling of Ferroelectricity In Reactively Sputtered Sc0.22Al0.78N (Invited Talk); Roozbeh Tabrizian, University of Florida, United States
Al0.7Sc0.3N Acoustically Coupled Filters with Large Bandwidth and Frequency Tunability; Sushant Rassay, Faysal Hakim, Roozbeh Tabrizian, University of Florida, United States
Congratulations to the students and researchers from IMG who were accepted to present at the 33rd IEEE MEMS 2020 Conference in Vancouver, Canada! IEEE MEMS is one of the largest conferences for MEMS experts to converge at. Overall, 11 papers from IMG were accepted out of 800+ abstracts submitted worldwide, as seen below:
Dr. David Arnold’s Group:
New IMG Professor Philip Feng presented in the ECE Seminar Series this week with a talk about his research titled, “Emerging Semiconductor Nanoscale Devices and Systems: From Fundamentals to Applications”. It was great to see him share his field of work with all the students in the UF ECE Department!
The speaker for this week's seminar is the new IMG faulty memmber, Dr. Philip Feng, whose talk is on
Multimode Resonant MEMS in Liquid: from Microscale Chladni Patterns to Cancer Cell Cluster Analysis
IMG warmly welcomes its newest faculty member—Dr. Philip Feng! Dr. Feng and his research group focus primarily on emerging semiconductor devices and integrated systems, and he has received numerous awards including the prestigious NSF CAREER Award. We believe he will be a great addition to our community!
For more information on Dr. Feng and his group, follow this link: https://www.img.ufl.edu/people/philip-feng
The Feng group's research endeavors are primarily focused on emerging solid-state devices and integrated systems, particularly resonant nano/micro electromechanical systems (NEMS/MEMS), 2D devices enabled by atomically thin crystals and their heterostructures, silicon carbide (SiC) and other advanced semiconductors (e.g., Ga2O3, diamond), quantum devices based on SiC and 2D materials, as well as their integration with mainstream CMOS integrated circuits (ICs) and state-of-the-art photoinc technologies.