Publications

Found 2 results
Author Title Type [ Year(Desc)]
Filters: First Letter Of Last Name is S and Author is Schmidt, Stephan  [Clear All Filters]
2020
Bowrothu, R., H. Kim, Y. Kyu Yoon, and S. Schmidt, "3D Integrated Through Fused Silica Via (TFV) Based Array Antenna for mm Wave Communications", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, IEEE, 2020.
2021
Bowrothu, R., H-in. Kim, Y. Kyu Yoon, S. Schmidt, and R. Santos, "Low Loss Cu/Co Multilayer Metaconductor Based Band Pass Filter Using Through Fused Silica Via (TFV) Technology", 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, IEEE, 2021.