| Title | 3D Integrated Through Fused Silica Via (TFV) Based Array Antenna for mm Wave Communications |
| Publication Type | Conference Paper |
| Year of Publication | 2020 |
| Authors | Bowrothu, R., H. Kim, Y. Kyu Yoon, and S. Schmidt |
| Conference Name | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| Publisher | IEEE |
| Conference Location | Orlando, FL, USA |
| URL | https://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=9151098https://ieeexplore.ieee.org/document/9159190/http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159190.pdf?arnumber=9159190 |
| DOI | 10.1109/ECTC32862.202010.1109/ECTC32862.2020.00028 |
