Ultra-Miniature Power Management for Microsystem Platforms

High density passive components (inductors, transformers, capacitors) are developed and integrated with high frequency (100-500 MHz) CMOS switching power conversion circuits. The  mm3-scale integrated converter will be capable of delivering >20 V from a battery source to enable mobile microsystems such as micro air vehicles and microrobots.

High-inductance-density air core inductors and transformers have been fabricated using a three-dimensional copper electroforming process. These devices have measured inductance densities > 100 nH/mm2  and quality factors > 20. Optimal performance is achieved in the range of 50 MHz - 500 MHz to enable next generation switching converters operating at very high frequencies.

SEM image of three-dimensional, stacked, air-core microinductor.

Project sponsor: 
Research Assistants: 
Non-IMG Research Assistants: 
Rizwan Bashirullah, Lin Xue, Christopher Dougherty
Project status: