IMG Professor, Dr. Saeed Moghaddam, discusses the future of data center chip cooling in this recent interview with Data Center Knowledge! An ARPA-E COOLERCHIPS Initiative Awardee, he advances cooling solutions for emerging CPUs and GPUs, reinventing how we think about data, energy, and the environment. Read the full interview HERE!
News and events of Saeed Moghaddam's Research Group
Congratulations to IMG Members Suhas Tamvada and Dr. Saeed Moghaddam on their recent publication in Applied Thermal Engineering! Titled “Data Center energy efficiency enhancement potential of a membrane-assisted phase-change heat sink”, This work demonstrates a new cooling technology which can help decarbonize Data Centers by efficiently cooling electronic chips.
Congratulations to IMG Member Suhas Tamvada and Dr. Saeed Moghaddam on their recent major discovery in nucleate boiling science! As featured on the UF MAE homepage, their research showed it is possible to overcome the limit of hydrodynamic instability to establish a flow condition in which the evaporation momentum limit is the ultimate limit.
Congratulations to IMG Member Suhas Tamvada and Dr. Saeed Moghaddam on their recent publication in the International Journal of Heat and Mass Transfer! Titled “On critical heat flux and its evaporation momentum and hydrodynamic limits,” this work explains the underlying physics of critical heat flux and demonstrates that the evaporation limit is the ultimate limit of CHF. Read more about their pioneering work here: https://doi.org/10.1016/j.ijheatmasstransfer.2022.123837
Congratulations to IMG Members Meisam Habibi Matin and Adam Kriz, and Dr. Saeed Moghaddam on their recent journal publication in Applied Thermal Engineering! Titled “Annular liquid film thermohydraulic and intermittent dryout in microchannel flow boiling,” this work fully resolves the intermittent dryout process in annular liquid film flow and uses interfacial shear stress to predict flow regime transition. Read more about their pioneering work here: https://doi.org/10.1016/j.applthermaleng.2022.119589