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"Influence of Layer Thickness on the Performance of Stacked Thick-Film Copper Air-Core Power Inductors", IEEE Transactions on Magnetics, vol. 48, issue 11, pp. 4436 - 4439, 11/2012.
, "Integrated Power Inductors and Capacitors Enabled by a Multilevel Molding Process", 220th ECS Meeting, Boston, MA, ECS, pp. 331 - 340, 2011.
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