Integrated Power Inductors and Capacitors Enabled by a Multilevel Molding Process

TitleIntegrated Power Inductors and Capacitors Enabled by a Multilevel Molding Process
Publication TypeConference Paper
Year of Publication2011
AuthorsMeyer, C. D., S. S. Bedair, L. Xue, C. M. Dougherty, R. Bashirullah, D. P. Arnold, and B. C. Morgan
Conference Name220th ECS Meeting
Conference LocationBoston, MA

We summarize here recent advancements toward integration of electronic passives for electrical power converters. Microscale inductors and capacitors with three-dimensional, free-standing copper traces are formed via a multi-layer molding and electroplating process. This capability creates two complementary routes for passives microfabrication: (a) high inductance density air-core inductors with vertically-stacked windings; and (b) inductors and capacitors with ferromagnetic and dielectric nanoparticles deposited through capillary-driven self-assembly. Several designs of air-core inductors are tested with inductance densities >100 nH/mm2 and quality factors >20. A suspended transmission line is encapsulated in NiFe2O4 magnetic nanoparticles for 25% greater inductance and no detriment to the quality factor up to 100 MHz. Deposition of BaTiO3 dielectric nanoparticles between nested capacitor electrodes yields up to a 6x increase in capacitance.

Refereed DesignationRefereed