Publications
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Filters: First Letter Of Title is M and Author is Hwangbo, Seahee [Clear All Filters]
"Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas", 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, IEEE, 2016.
, "Mutual Coupling Reduction Using Micromachined Complementary Meander-Line Slots for a Patch Array Antenna", IEEE Antennas and Wireless Propagation Letters, vol. 16, pp. 1667 - 1670, Feb-02-2017.
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