Publications
"Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications", 2021 IEEE 71st Electronic Components and Technology Conference, 2021.
, "Metaconductor Based Highly Energy Efficient Differential Striplines for 112 Gbps Data Bus With Sub 0.1 dB/mm Package Insertion Loss", 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022.
, "Demonstration of Substrate-Embedded Nonreciprocal Millimeter-Wave Circulators For System-In-Packaging", 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), 2022.
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