Publications

Found 14 results
Author Title [ Type(Desc)] Year
Filters: Author is Judy, Jack W.  [Clear All Filters]
Conference Paper
Desai, V. H., B. S. Spearman, C. S. Shafor, S. Natt, B. Teem, J. B. Graham, E. W. Atkinson, R. A. Wachs, E. A. Nunamaker, K. J. Otto, et al., "Design, fabrication, and characterization of a scalable tissue-engineered-electronic-nerve-interface (TEENI) device", 2017 8th International IEEE/EMBS Conference on Neural Engineering (NER), Shanghai, China, IEEE, 2017.
Fluker, Jr., K. A., and J. W. Judy, "Fabrication Process for Ultra-Reliable Polyimide-Based Neural-Interface Technology", 2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Orlando, FL, USA, IEEE, 08/2025.
Tahafchi, P., R. Molina, J. A. Roper, K. Sowalsky, C. J. Hass, A. Gunduz, M. S. Okun, and J. W. Judy, "Freezing-of-Gait detection using temporal, spatial, and physiological features with a support-vector-machine classifier", 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju Island, South Korea, IEEE, 2017.
Graham, J. B., E. W. Atkinson, E. A. Nunamaker, B. S. Spearman, V. H. Desai, C. S. Shafor, S. Natt, R. A. Wachs, C. E. Schmidt, J. W. Judy, et al., "Histological evaluation of chronically implanted tissue-engineered-electronic-neural-interface (TEENI) devices", 2017 8th International IEEE/EMBS Conference on Neural Engineering (NER), Shanghai, China, IEEE, 2017.
Nunamaker, E. A., B. S. Spearman, J. B. Graham, E. W. Atkinson, V. H. Desai, C. S. Shafor, S. Natt, R. A. Wachs, C. E. Schmidt, J. W. Judy, et al., "Implantation methodology development for tissue-engineered-electronic-neural-interface (TEENI) devices", 2017 8th International IEEE/EMBS Conference on Neural Engineering (NER), Shanghai, China, IEEE, 2017.
Fluker, K. A., S. Mahmud, H. Wu, A. Khalifa, and J. W. Judy, "Miniaturized, RF-Based, and Battery-Free Stimulators Packaged with Polymer-Metal Flex Circuits for Implant Applications", 2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Orlando, FL, USA, IEEE, 08/2025.